Gold Superfill in Sub-Micrometer Trenches: Experiment and Prediction

Published

November 16, 2005

Author(s)

Daniel Josell, Daniel Wheeler, Thomas P. Moffat

Abstract

Bottom-up deposition of gold in fine trenches, also called superfill, was recently demonstrated using a submonolayer coverage of preadsorbed, deposition-rate-accelerating lead followed by gold electrodeposition. The present study has used experiments on planar substrates to quantify gold electrodeposition. The present study has used experiments on planar substrates to quantify the kinetics of the Pb adsorbtion process, the impact of the adsorbate on the Au deposition rate, and the rate at which the adsorbed Pb was consumed during the Au deposition process. The values obtained have been incorporated into the Curvature Enhanced Accelerator Coverage mechanism of superfill where they were used to quantitatively predict the highly non-conformal, bottom-up deposition observed during filling of the patterned features. The results indicate the potential of the process for Damascene interconnect fabrication in GaAs, GaN and related technologies.

Citation

Journal of the Electrochemical Society

Volume

153

Issue

1

Pub Type

Journals

Download Paper

Local Download

Citation

Josell, D. , Wheeler, D. and Moffat, T. (2005), Gold Superfill in Sub-Micrometer Trenches: Experiment and Prediction, Journal of the Electrochemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853399 (Accessed December 8, 2024)