Josell, D.
, Moffat, T.
and Wheeler, D.
(2007),
Superfilling When Adsorbed Accelerators Are Mobile, Journal of the Electrochemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853474
(Accessed December 10, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Superfilling When Adsorbed Accelerators Are Mobile
Published
Author(s)
, ,
Abstract
Bottom-up superfill during electrodeposition that is used for industrial processing of damascene copper interconnects has also been demonstrated during electrodeposition of silver and gold. The Curvature Enhanced Accelerator Coverage (CEAC) mechanism has been proposed to underlie all three processes and has been used to quantitatively predict observed filling of patterned features. The key feature of the CEAC mechanism is redistribution of adsorbed additives through changes of local surface area as dictated by mass conservation and the relative strengths of adsorption. Adsorbate diffusion along the surface that might arise during deposition due to the resulting CEAC-induced gradients in surface coverage has been neglected. This paper extends the CEAC model to include such diffusion, applying the resulting formulation to understand differences in the geometries of experimental superfilling systems.Citation
Journal of the Electrochemical Society
Volume
154
Issue
4
Pub Type
Journals
Download Paper
Keywords
CEAC, diffusion, electrodeposition
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created February 5, 2007, Updated October 12, 2021