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Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

Published

Author(s)

Thomas P. Moffat, Daniel Wheeler, Soo K. Kim, Daniel Josell

Abstract

The impact of leveling additives acting through the traditional leveling mechanism of accumulation and consumption has been coupled with the Curvature Enhanced Accelerator Coverage (CEAC) mechanism previously used to explain bottom-up superfill of features in the presence of deposition rate-accelerating additives. This work examines feature filling in the presence of both accelerating and leveling additives through model of multiple adsorbate accumulation, redistribution during area change and adsorbate consumption, using the resulting equations to analyze superfill of submicrometer dimension features and subsequent overfill bump formation. These predictions explain how leveling additives can decrease the height of overfill bumps formed over superfilled features, consistent with experimental observation.
Citation
Journal of the Electrochemical Society
Volume
153
Issue
2

Citation

Moffat, T. , Wheeler, D. , Kim, S. and Josell, D. (2006), Curvature Enhanced Adsorbate Coverage Model for Electrodeposition, Journal of the Electrochemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853390 (Accessed May 18, 2024)

Issues

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Created January 11, 2006, Updated June 2, 2021