Moffat, T.
, Wheeler, D.
, Kim, S.
and Josell, D.
(2006),
Curvature Enhanced Adsorbate Coverage Model for Electrodeposition, Journal of the Electrochemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853390
(Accessed April 26, 2024)
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Curvature Enhanced Adsorbate Coverage Model for Electrodeposition
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Abstract
The impact of leveling additives acting through the traditional leveling mechanism of accumulation and consumption has been coupled with the Curvature Enhanced Accelerator Coverage (CEAC) mechanism previously used to explain bottom-up superfill of features in the presence of deposition rate-accelerating additives. This work examines feature filling in the presence of both accelerating and leveling additives through model of multiple adsorbate accumulation, redistribution during area change and adsorbate consumption, using the resulting equations to analyze superfill of submicrometer dimension features and subsequent overfill bump formation. These predictions explain how leveling additives can decrease the height of overfill bumps formed over superfilled features, consistent with experimental observation.Citation
Journal of the Electrochemical Society
Volume
153
Issue
2
Pub Type
Journals
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Citation
Created January 11, 2006, Updated June 2, 2021