Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

Published

Author(s)

Thomas P. Moffat, Daniel Wheeler, Soo K. Kim, Daniel Josell

Abstract

The impact of leveling additives acting through the traditional leveling mechanism of accumulation and consumption has been coupled with the Curvature Enhanced Accelerator Coverage (CEAC) mechanism previously used to explain bottom-up superfill of features in the presence of deposition rate-accelerating additives. This work examines feature filling in the presence of both accelerating and leveling additives through model of multiple adsorbate accumulation, redistribution during area change and adsorbate consumption, using the resulting equations to analyze superfill of submicrometer dimension features and subsequent overfill bump formation. These predictions explain how leveling additives can decrease the height of overfill bumps formed over superfilled features, consistent with experimental observation.
Citation
Journal of the Electrochemical Society
Volume
153
Issue
2

Citation

Moffat, T. , Wheeler, D. , Kim, S. and Josell, D. (2006), Curvature Enhanced Adsorbate Coverage Model for Electrodeposition, Journal of the Electrochemical Society, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853390 (Accessed October 14, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created January 11, 2006, Updated June 2, 2021