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Electronics

Semiconductors

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Displaying 251 - 275 of 1445

SiC power MOSFET gate oxide breakdown reliability – Current status

May 3, 2018
Author(s)
Kin P. Cheung
SiC power MOSFET is poised to take off commercially. Gate oxide breakdown reliability is an important obstacle standing is the way. Early prediction of poor intrinsic reliability comparing to silicon MOSFET, while theoretically sound, has now proven way

Wafer-Level Electrically Detected Magnetic Resonance:Magnetic Resonance in a Probing Station

March 20, 2018
Author(s)
Duane J. McCrory, Mark Anders, Jason Ryan, Pragya Shrestha, Kin P. Cheung, Patrick M. Lenahan, Jason Campbell
We report on a novel semiconductor reliability technique that incorporates an electrically detected magnetic resonance (EDMR) spectrometer within a conventional semiconductor wafer probing station. EDMR is an ultrasensitive electron paramagnetic resonance

Glassy Phases in Organic Semiconductors

March 17, 2018
Author(s)
Chad R. Snyder, Dean M. DeLongchamp
Organic semiconductors may be processed from fluids using graphical arts printing and patterning techniques to create complex circuitry. Because organic semiconductors are weak van der Waals solids, the creation of glassy phases during processing is quite

Paper in electronic and optoelectronic devices

March 6, 2018
Author(s)
Dongheon Ha, Zhiqiang Fang, Nikolai B. Zhitenev
The demand for lightweight, cost-effective, and/or flexible electronic and optoelectronic devices drives research toward new materials advancing the desired functionality or reducing manufacturing costs. Paper, being in addition an earth abundant and

Synchrotron Methods for Flexible Hybrid Electronics Industrial Recommendations on Interagency (DoC-DoD-DoE) Partnerships to Address Measurement Challenges Hindering the Flexible Hybrid Electronics Manufacturing Ecosystem

February 12, 2018
Author(s)
Christopher L. Soles, Richard A. Vaia, Ronald Pindak
The round-table participants concluded that facilities at NSLS-II provide immediate opportunities to address some of the critical processing and measurement challenges that are blocking the path towards a sustainable US-centric Flexible Hybrid Electronic
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