Reliability Characterization of Au-In Transient Liquid Phase Bonding through Electrical Resistivity Measurement

Published

November 19, 2015

Author(s)

Brian J. Grummel, Habib A. Mustain, Z. J. Shen, Allen R. Hefner Jr.

Abstract

Transient liquid phase (TLP) bonding has shown to be an attractive die-attach material and solder for high-temperature packaging. The material reliability of Au-In TLP has been investigated in this work utilizing electrical resistivity measurement as an indicator of material diffusion. TLP test samples were fabricated with multiple Au-In compositions with identical barrier layers to analyze their reliability. The samples were fabricated by material deposition on glass slides, annealed at 200 °C, and degraded with uniform thermal cycling. Samples containing high In content were shown to have poor reliability due to material diffusion through barrier layers while samples containing suitable Au content proved reliable through electrical resistivity measurement, EDS, FIB, and SEM characterization.

Citation

IEEE Transactions on Components Packaging and Manufacturing Technology

Volume

5

Pub Type

Journals

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DOI Link

Keywords

Au-In, Die-Attach, High-Temperature, Packaging, Power Semiconductor, Silicon Carbide (SiC), Solid Liquid Interdiffusion (SLID), Transient Liquid Phase (TLP) Bonding, Wide-Bandgap

Citation

Grummel, B. , Mustain, H. , Shen, Z. and Hefner, A. (2015), Reliability Characterization of Au-In Transient Liquid Phase Bonding through Electrical Resistivity Measurement, IEEE Transactions on Components Packaging and Manufacturing Technology, [online], https://doi.org/10.1109/TCPMT.2015.2489686 (Accessed December 13, 2024)