Grummel, B.
, Mustain, H.
, Shen, Z.
and Hefner, A.
(2015),
Reliability Characterization of Au-In Transient Liquid Phase Bonding through Electrical Resistivity Measurement, IEEE Transactions on Components Packaging and Manufacturing Technology, [online], https://doi.org/10.1109/TCPMT.2015.2489686
(Accessed April 19, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Reliability Characterization of Au-In Transient Liquid Phase Bonding through Electrical Resistivity Measurement
Published
Author(s)
, Habib A. Mustain, Z. J. Shen,
Abstract
Transient liquid phase (TLP) bonding has shown to be an attractive die-attach material and solder for high-temperature packaging. The material reliability of Au-In TLP has been investigated in this work utilizing electrical resistivity measurement as an indicator of material diffusion. TLP test samples were fabricated with multiple Au-In compositions with identical barrier layers to analyze their reliability. The samples were fabricated by material deposition on glass slides, annealed at 200 °C, and degraded with uniform thermal cycling. Samples containing high In content were shown to have poor reliability due to material diffusion through barrier layers while samples containing suitable Au content proved reliable through electrical resistivity measurement, EDS, FIB, and SEM characterization.Citation
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume
5
Pub Type
Journals
Download Paper
Keywords
Au-In, Die-Attach, High-Temperature, Packaging, Power Semiconductor, Silicon Carbide (SiC), Solid Liquid Interdiffusion (SLID), Transient Liquid Phase (TLP) Bonding, Wide-Bandgap
Citation
Created November 19, 2015, Updated November 10, 2018