TY  - JOUR
AU  - Brian Grummel
AU  - Habib Mustain
AU  - Z. Shen
AU  - Allen Hefner
C2  - IEEE Transactions on Components Packaging and Manufacturing Technology
DA  - 2015-11-19
DO  - https://doi.org/10.1109/TCPMT.2015.2489686
LA  - en
M1  - 5
PB  - IEEE Transactions on Components Packaging and Manufacturing Technology
PY  - 2015
TI  - Reliability Characterization of Au-In Transient Liquid Phase Bonding through Electrical Resistivity Measurement
ER  -