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Electronics

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Displaying 451 - 475 of 695

A High-Speed Thermal Imaging System for Semiconductor Device Analysis

April 1, 2001
Author(s)
Allen R. Hefner Jr., David W. Berning, David L. Blackburn, Christophe C. Chapuy, Sebastien Bouche
A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a silicon chip with 1 υs time, and 15 υm spatial resolution. The system uses virtual instrument

IGBT Model Validation for Soft-Switching Applications

March 31, 2001
Author(s)
David W. Berning, Allen R. Hefner Jr.
Techniques are described for validating the performance of Insulated-Gate Bipolar Transistor (IGBT) circuit simulator models for soft-switching circuit conditions. The circuits used for the validation include a soft-switched boost converter similar to that

SiC Power Diodes Provide Breakthrough Performance for a Wide Range of Applications

March 1, 2001
Author(s)
Allen R. Hefner Jr., Ranbir Singh, Jih-Sheng Lai, David W. Berning, Sebastien Bouche, Christophe C. Chapuy
The electrical performance of Silicon Carbide (SiC) diodes are evaluated and compared to commercially available Silicon (Si) diodes in the voltage range from 600 V through 5000 V. The comparisons include the on-state characteristics, the reverse recovery

Exploring Site Quality Above 1 GHz Using Double Ridged Horns

February 1, 2001
Author(s)
Dennis G. Camell, Robert T. Johnk, K. R. Hall
This is a summary of recent exploratory efforts conducted by the American National Standards Institute (ANSI) Accredited Standards Committee C63, Sub-Committee 1,working group 1-13.2 on site requirements for radiated measurements above 1GHz. The main

Measuring Antennas Above 1 GHz

February 1, 2001
Author(s)
Michael Windler, Dennis G. Camell
The techniques for EMC measurements used with antennas above 1 GHz have been gleaned from methods used at lower frequencies. The assumptions made in applying these techniques have not been completely validated. This analysis will compare antennas for use

A Comparison of Quantum-Mechanical Capacitance-Voltage Simulators

January 1, 2001
Author(s)
Curt A. Richter, Allen R. Hefner Jr., Eric M. Vogel
We have systematically compared the results of an extensive ensemble of the most advanced available quantum-mechanical capacitance-voltage simulation and analysis packages for a range of metal-oxide-semiconductor device parameters. While all have similar

Electron Attachment Cross Sections and Negative Ion States of SF6

January 1, 2001
Author(s)
Loucas G. Christophorou, James K. Olthoff
A comprehensive and critical assessment of published data on the total, dissociative, and nondissociative electron attachment cross sections for SF 6 allowed us to recommend or suggest room temperature values for these cross sections over an energy range

Electron Interactions with c-C 4 F 8

January 1, 2001
Author(s)
Loucas G. Christophorou, James K. Olthoff
The limited electron collision cross-section and transport-coefficient data for the plasma processing gas perfluorocyclobutane (c-C 4F 8) are synthesized, assessed, and discussed. These include cross sections for total electron scattering, differential

Electron Collision Data for Plasma-Processing Gases

October 1, 2000
Author(s)
Loucas G. Christophorou, James K. Olthoff
Low-temperature plasma applications require detailed understanding of the physical and chemical processes occurring in the plasmas themselves. For instance, as the push for smaller feature sizes and higher quality devices in the semiconductor industry has

Electron Interactions with Excited Atoms and Molecules

October 1, 2000
Author(s)
Loucas G. Christophorou, James K. Olthoff
Elastic, inelastic, and superelastic scattering of electrons by and electron-impact ionization of excited atoms are reviewed and discussed and the role of the electric dipole polarizabilty in the interaction of slow electrons with excited atoms is

Inductively Coupled Plasmas in Low Global Warming Potential Gases

August 1, 2000
Author(s)
Amanda N. Goyettes, Yicheng Wang, James K. Olthoff
Many high density discharges used in microelectronics fabrication use fluorocarbon gases with coincidentally high global-warming potentials (GWPs). We have determined the identities, fluxes, and energy distributions of ions produced in high density

Automated Parameter Extraction Software for Advanced IGBT Modeling

July 10, 2000
Author(s)
Allen R. Hefner Jr., Sebastien Bouche
A software package for extracting parameters used in advanced IGBT models is presented. In addition, new model equations and extraction procedures are introduced that more accurately describe a wide range of IGBT types including the recently developed Warp

Multiport Noise Characterization and Differential Amplifiers

June 1, 2000
Author(s)
James P. Randa
I address the issue of the definition and measurement of noise figure and parameters to characterize multiport devices, particularly differential amplifiers. A parameterization in terms of the noise matrix appears to be the most practical. The noise figure

4 Amp 4H-SiC JBD Diodes

May 1, 2000
Author(s)
Ranbir Singh, Sei-Hyung Ryu, M. Palmer, Allen R. Hefner Jr., Jih-Sheng Lai
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