Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

A High-Speed Thermal Imaging System for Semiconductor Device Analysis

Published

Author(s)

Allen R. Hefner Jr., David W. Berning, David L. Blackburn, Christophe C. Chapuy, Sebastien Bouche

Abstract

A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a silicon chip with 1 υs time, and 15 υm spatial resolution. The system uses virtual instrument graphical user interface software that controls an infrared thermal microscope, translation stages, digitizing oscilloscope, and a device test fixture temperature controller. The computer interface consists of a front panel for viewing the temperature distribution and includes a movie play back feature that enables viewing of the temperature distribution versus time. The computer user interface also has a sub-panel for emissivity mapping and calibration of the infrared detector. The utility of the system is demonstrated in this paper using a bipolar transistor hotspot current constriction process.
Proceedings Title
Proc., Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Conference Dates
March 20-22, 2001
Conference Location
San Jose, CA, USA

Keywords

infrared thermal measurement, semiconductor device heating, transient thermal image

Citation

Hefner Jr., A. , Berning, D. , Blackburn, D. , Chapuy, C. and Bouche, S. (2001), A High-Speed Thermal Imaging System for Semiconductor Device Analysis, Proc., Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, CA, USA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=15525 (Accessed March 4, 2024)
Created March 31, 2001, Updated October 12, 2021