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Conferences

NIST SRM (Standard Reference Material) 2460/2461 Standard Bullets and Casings Project

October 13, 2009

Author(s)

Jun-Feng Song, Thomas Brian Renegar, Xiaoyu Alan Zheng, Robert M. Thompson, Richard M. Silver, Martin M. Ols, Ted T. Vorburger

The National Institute of Standards and Technology (NIST) in collaboration with the Bureau of Alcohol, Tobacco, Firearms, and Explosives (ATF) has developed the...

An efficient, optical fiber-based waveguide interface to a single quantum dipole

October 12, 2009

Author(s)

Marcelo I. Davanco, Kartik A. Srinivasan

We theoretically investigate a single emitter embedded in a hybrid optical waveguide that proves highly efficient, optical fiber access to the dipole transition...

Gate Oxide Long-Term Reliability of 4H-SiC MOS Devices

October 11, 2009

Author(s)

Liangchun (. Yu, Kin P. Cheung, Greg Dunne, Kevin Matocha, John S. Suehle, Kuang Sheng

Correlated Photon Pair Generation by Dual-Element PPKTP Waveguide over GHz repetition rate

October 11, 2009

Author(s)

Xiao Tang, Lijun Ma, Oliver T. Slattery

A compact scheme for high-speed frequency doubling and down-conversion on a single dual-element PPKTP waveguide is investigated. Optimal temperature selection...

Wafer-level Hall Measurement on SiC MOSFET

October 11, 2009

Author(s)

Liangchun (. Yu, Kin P. Cheung, Vinayak Tilak, Greg Dunne, Kevin Matocha, Jason P. Campbell, John S. Suehle, Kuang Sheng

Volume Estimation of Molded Artifacts by B-Splines

October 9, 2009

Author(s)

David E. Gilsinn, Bruce R. Borchardt, Amelia Tebbe

The volumes of two industrially molded non-metallic artifacts were estimated using surface data obtained by a coordinate measuring machine. A tensor product of...

Results of an international photomask linewidth comparison of NIST and PTB

October 9, 2009

Author(s)

Bernd Bodermann, Detleff Bergmann, Egbert Buhr, Wolfgang Haebler-Grohne, Harald Bosse, James E. Potzick, Ronald G. Dixson, Richard Quintanilha, Michael T. Stocker, Andras Vladar, Ndubuisi George Orji

In preparation of the international Nano1 linewidth comparison on photomasks between 9 national metrology institutes, NIST and PTB have started a bilateral...

Quantifying the Performance of MT-Connect in a Distributed Manufacturing Environment

October 8, 2009

Author(s)

John L. Michaloski, Byeong Eon Lee, Frederick M. Proctor, Sid Venkatesh, Sidney Ly

In the CNC manufacturing world, the continuing pressure to reduce costs and improve time to market places a premium on smarter ways of manufacturing and...

Mathematical Metrology for Evaluating a 6DOF Visual Servoing System

October 8, 2009

Author(s)

Tommy Chang, Tsai H. Hong, Milli Shah, Roger D. Eastman

In this paper we develop the best homogeneous matrix trans- formation to fit two streams of dynamic six-degree-of-freedom (6DOF) data for evaluating perception...

The Effects of Integration Time and Size-of-Source on the Temperature Measurement of Segmented Chip Formation Using Infrared Thermography

October 7, 2009

Author(s)

Jarred C. Heigel, Eric P. Whitenton

This paper illustrates the errors due to integration time and size-of-source effects when measuring the temperature of segmented chip formation using infrared...

Ontology Formalisms: What is Appropriate for Different Applications?

October 6, 2009

Author(s)

Craig I. Schlenoff

Ontologies can take many forms. There are ontologies that are extremely formal (e.g., using first order logic), and there are ontologies that are much less...

Advanced Capacitance Metrology for Nanoelectronic Device Characterization

October 5, 2009

Author(s)

Curt A. Richter, Joseph J. Kopanski, Yicheng Wang, Muhammad Y. Afridi, Xiaoxiao Zhu, D. E. Ioannou, Qiliang Li, Chong Jiang

We designed and fabricated a test chip (consisting of an array of metal-oxide-semiconductor (MOS) capacitors and metal-insulator-metal (MIM) capacitors ranging...

Temperature-Programmed Gas-Sensing With Microhotplates: An Opportunity to Enhance Microelectronic Gas Sensor Metrology

October 5, 2009

Author(s)

Jon C. Geist, Muhammad Y. Afridi

It is only recently that the ITRS (International Technical Roadmap for Semiconductors) has identified functional diversification through heterogeneous...

Enhanced Spatial Resolution Scanning Kelvin Force Microscopy Using Conductive Carbon Nanotube Tips

October 5, 2009

Author(s)

Joseph J. Kopanski, Paul McClure, Vladimir Mancevski

The response of a scanning Kelvin force microscope (SKFM) was measured with conventional micromachined silicon tips coated with Au and with advanced tips...

Measuring the EUV-induced contamination rates of TiO2-capped multilayer optics by anticipated production-environment hydrocarbons

October 1, 2009

Author(s)

Shannon B. Hill, Nadir S. Faradzhev, Charles S. Tarrio, Thomas B. Lucatorto, Robert A. Bartynski, B. V. Yakshinskiy, T. E. Madey

The primary, publicly reported cause of optic degradation in pre-production extreme-ultraviolet (EUV) lithography systems is carbon deposition. This results...

Development of an infrared optical scattering instrument from 1 um to 5 um

October 1, 2009

Author(s)

Jinan Zeng, Leonard M. Hanssen

The wavelength coverage of the IR optical scattering instrument developed at the National Institute of Standards and Technology has been extended to cover the...

An Improved Digital Image Correlation Method Applied to Scanning Probe Microscope Images

October 1, 2009

Author(s)

Wei Chu, Joseph Fu, Theodore V. Vorburger

Digital image correlation (DIC) is a method for measuring the surface displacements and displacement gradients in materials under deformation. During the...

Correction of Hysteresis in SPM Image by a Moving Window Correlation Method

October 1, 2009

Author(s)

Joseph Fu

Many scanning probe microscopes (SPMs), such as the scanning tunneling microscope (STM) and atomic force microscope (AFM), use piezoelectric actuators operating...

Virtual Testing of Concrete Transport Properties

October 1, 2009

Author(s)

Dale P. Bentz, Edward J. Garboczi, Nicos Martys, Kenneth A. Snyder, W. S. Guthrie, Konstantinos Kyritsis, Narayanan Neithalath

The transport properties of concrete are critical to its field performance. Commonly encountered degradation mechanisms are dependent on ionic diffusivity...

Development of Domain-Specific Scenarios for Training and Evaluation of Two-Way, Free Form, Spoken Language Translation Devices

October 1, 2009

Author(s)

Brian A. Weiss, Marnie Menzel

To create effective and accurate two-way, free form, spoken language translation devices, they must be supplied with appropriate training data. The goal of the...

Virtual Cement and Concrete Testing Laboratory for Quality Testing and Sustainability of Concrete

October 1, 2009

Author(s)

Jeffrey W. Bullard, Paul E. Stutzman, Luis M. Ordonez-Belloc, Edward J. Garboczi, Dale P. Bentz

The NIST-Industry Virtual Cement and Concrete Testing Laboratory (VCCTL) Consortium has developed an integrated software package for performing simulations of a...

Earthquakes, Hurricanes, Floods, Every Day Failures and 1500 Miles of Levee - Risk Analysis Experiences and Lessons

October 1, 2009

Author(s)

Martin W. McCann , Said Salah-Mars, Jerry L. Foster, Gregory B. Baecher, Robert C. Patev, Harvey W. Jones, Therese P. McAllister

By the first quarter of 2006, two risk studies of major levee systems (over 1500 miles of levee) in the U.S. were underway. The IPET Risk and Reliability...

Assessment of Performance Metrics for Use of Wireless Sensor Networks in Buildings

September 30, 2009

Author(s)

Won Suk Jang, William M. Healy

This paper is part of an effort to develop measurement systems and methods to better predict the performance of wireless sensor and control networks in building...

Evaluating Speech Translation Systems: Applying SCORE to TRANSTAC Technologies

September 29, 2009

Author(s)

Craig I. Schlenoff, Brian A. Weiss, Michelle P. Steves, Gregory A. Sanders, Frederick M. Proctor, Ann M. Virts

The Spoken Language Communication and Translation System for Tactical Use (TRANSTAC) program is a Defense Advanced Research Projects Agency (DARPA) advanced...

Improving Data Quality in Embedded Sensor Systems for APC

September 28, 2009

Author(s)

Julien M. Amelot, YaShian Li-Baboud

Achieving next-generation factory (NGF) goals has been an industry challenge for APC applications to acquire a sufficient level of data quality to maximize the...

Nonaqueous Solvatochromic Behavior of Nile Blue A Perchlorate in Imidazolium Exchanged Clays and its Implication Toward Exfoliation in Polymeric Composites

September 28, 2009

Author(s)

Douglas M. Fox, Jeffrey W. Gilman, Paul H. Maupin

UV/VIS absorption and emission spectroscopy is a powerful tool for probing solute-solvent interactions. Recently, we have identified the use of Nile Blue as a...

A Time Synchronization Testbed to Define and Standardize Real-Time Model-Based Control Capabilities in Semiconductor Manufacturing

September 28, 2009

Author(s)

Deepak Sharma, Dhananjay Anand, Ya-Shian Li-Baboud, James Moyne

Shrinking process tolerances due to decreasing device sizes and increasing chip complexity in semiconductor manufacturing are motivating efforts to improve...

The Impact of Scenario Development on the Performance of Speech Translation Systems Prescribed by the SCORE Framework

September 25, 2009

Author(s)

Brian A. Weiss, Craig I. Schlenoff

The Defense Advanced Research Projects Agency's (DARPA) Spoken Language Communication and Translation for Tactical Use (TRANSTAC) program is a focused advanced...

Measurement Traceability and Quality Assurance in a Nanomanufacturing Environment

September 25, 2009

Author(s)

Ndubuisi G. Orji, Ronald G. Dixson, Aaron Cordes, Benjamin Bunday, John Allgair

A key requirement for nano-manufacturing is maintaining acceptable traceability of measurements performed to determine size. Given that properties and...

High-Voltage Capacitance Measurement System for SiC Power MOSFETs

September 24, 2009

Author(s)

Parrish Ralston, Tam H. Duong, Nanying Yang, David W. Berning, Colleen E. Hood, Allen R. Hefner Jr., Kathleen Meehan

Adequate modeling of a power MOSFET is dependent on accurate characterization of the inter-electrode capacitances. With the advent of high voltage silicon...

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