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Develop AI-powered software to automate chip design optimization for manufacturability through accelerated lithography simulation. This project will benefit U.S. researchers and industry involve in semiconductor design and manufacturing.
Develop a new instrument for high-speed thermal properties analysis and simultaneous chemical characterization with sub-micron spatial resolution. This project will improve thermal management and thermal property characterization for the U.S. semiconductor industry.
Develop hybrid atomic force microscopy instrument that will automatically generate maps of the thermal resistance, thermal boundary interface resistance, and temperature profiles of microprocessors and wide bandgap semiconductor materials and devices. This project will benefit devices with thermal management challenges and materials development needs on length scales smaller than 100 nanometers.
Develop a new measurement tool to analyze airborne contaminants and toxic gases inside and outside the fab that lead to semiconductor processing defects and safety infringements. This project will benefits U.S semiconductor fabrication facilities.
Develop cutting-edge technology for calibration of the instrument transfer function of extreme ultraviolet (EUV) lithographic tools. This project will advance EUV lithography technology for the U.S. semiconductor industry.
Develop a simulation tool for photonic integrated circuits that accounts for manufacturing variations and imperfections. This project will benefit the designers of photonic integrated circuits, who will have faster development times as well as U.S. semiconductor manufacturers and fabrication facilities.
Created September 6, 2024, Updated September 19, 2024