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Displaying 51 - 75 of 78

Report of the Workshop on Reliability Issues in Nanomaterials

January 1, 2007
Author(s)
Robert Keller, David T. Read, Roop L. Mahajan
The Workshop on Reliability Issues in Nanomaterials was held at the Boulder Laboratories of the U. S. Department of Commerce on August 17-19, 2004. It was organized by the National Institute of Standards and Technology (NIST) and was designed to promote a

Results of a Nanoindentation Round Robin on Thin Film Copper on Silicon

January 1, 2007
Author(s)
David T. Read, Robert Keller, Nicholas Barbosa, Roy H. Geiss
Nanoindentation is used in a variety of fields to measure material hardness and elastic modulus. This test technique is especially attractive for thin films because of the difficulty of conducting tensile or other conventional mechanical characterization

Strain-Induced Grain Growth during Rapid Thermal Cycling of Aluminum Interconnects

January 1, 2007
Author(s)
Robert Keller, Roy H. Geiss, Nicholas Barbosa, Andrew Slifka, David T. Read
We demonstrate by use of automated electron backscatter diffraction (EBSD) the rapid growth of grains in non-passivated, sputtered Al-1Si interconnects during 200 Hz thermal cycling induced by alternating electric current. Mean grain diameters were

COMPARISON OF TEXTURE IN COPPER AND ALUMINUM THIN FILMS AS DETERMINED BY XRD AND EBSD

October 2, 2006
Author(s)
Jens Mueller, Davor Balzar, Roy H. Geiss, David T. Read, Robert Keller
Texture in materials has a large influence on many properties of thin films; it is customarily determined by neutron or X-ray diffraction by measuring pole figures and evaluating orientation-distribution functions (ODF). X-ray diffraction (XRD) was the

Anisotropic elastic properties of nanocrystalline nickel thin films

May 1, 2006
Author(s)
Donna C. Hurley, Roy H. Geiss, N Jennett, Malgorzata Kopycinska-Mueller, A Maxwell, Jens Mueller, David T. Read, J Wright
As length scales continue to shrink, new tools are needed to measure mechanical properties. We are developing two such tools using different nondestructive acoustical techniques. Surface acoustic wave spectroscopy (SAWS) uses laser-ultrasonic methods to

Multiscale Modeling of Germanium Quantum Dots in Silicon

December 30, 2005
Author(s)
Vinod Tewary, David T. Read
A method is described for multiscale modeling of a quantum dot in a semiconductor containing a free surface. The method is based upon the use of the lattice-statics and continuum Green's functions integrated with classical molecular dynamics. It fully

Electrical Methods for Mechanical Characterization of Interconnect Thin Films

September 1, 2005
Author(s)
Robert Keller, Cynthia A. Volkert, Roy H. Geiss, Andrew Slifka, David T. Read, Nicholas Barbosa, Reiner Monig
We describe the use of electrical methods for evaluating mechanical reliability and properties of patterned copper and aluminum interconnects on silicon substrates. The approach makes use of controlled Joule heating, which causes thermal strains in the

Workshop on Reliability Issues in Nanomaterials

August 1, 2005
Author(s)
Robert Keller, David T. Read, Roop L. Mahajan
The Workshop on Reliability Issues in Nanomaterials was held at the Boulder Laboratories of the National Institute of Standards and Technology (NIST) on August 17-19, 2004. It was designed to promote a particular subset of NIST?s responsibilities under the

Acoustical methods to determine thin-film and nanoscale mechanical properties

May 31, 2005
Author(s)
Donna C. Hurley, Roy H. Geiss, N Jennett, Malgorzata Kopycinska-Mueller, A Maxwell, Jens Mueller, David T. Read, J Wright
We describe two acoustical methods to evaluate the mechanical properties of thin films and nanoscale structures: atomic force acoustic microscopy and surface acoustic wave spectroscopy. The elastic properties of an 800-nm-thick nickel film were examined

Electric Current Induced Thermomechanical Fatigue Testing of Interconnects

March 1, 2005
Author(s)
Robert Keller, Roy H. Geiss, Yi-Wen Cheng, David T. Read
We demonstrate the use of electrical methods for evaluating the thermomechanical fatigue properties of patterned aluminum and copper interconnects on silicon-based substrates. Through a careful selection of alternating current frequency and current density

Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures

November 19, 2004
Author(s)
David T. Read, Yi-Wen Cheng, Roy H. Geiss
The temperature dependence of the strength of a thin copper electrodeposit has been measured from room temperature to 150 °C by microtensile testing. The ultimate tensile strength decreased from around 240 MPa at room temperature to just above 200 MPa at

Microstructure Evolution during Alternating-Current-lnduced Fatigue

November 1, 2004
Author(s)
Robert Keller, Roy H. Geiss, Yi-Wen Cheng, David T. Read
Subjecting electronic interconnect lines to high-density, low.frequency alternating current creates cyclic thermomechanical stresses that eventually cause electrical failure. A detailed understanding of the failure process could contribute to both

Mechanical Behavior of Contact Aluminum Alloy

January 1, 2003
Author(s)
David T. Read, Yi-Wen Cheng, Joseph D. McColskey, R R. Keller
Here we report the results of tensile tests of thin films of Al-0.5 % Cu deposited on bare silicon. This material was on a wafer that was subjected to the complete CMOS fabrication process, tensile strength, and elongation were all lower than the

Applying a Methodology for Microtensile Analysis of Thin Films

June 1, 2002
Author(s)
B Yeung, Alan M. Lytle, V Sarihan, David T. Read, Y F. Guo
A Microtensile methodology, developed at The National Institute of Standards and Technology (NIST), has been adopted and applied in Motorola to evaluate material properties of thin films. this methodology is a significant part of the materials technology

Tensile Properties of Free-Standing Aluminum Thin Films

September 1, 2001
Author(s)
David T. Read, Yi-Wen Cheng, R R. Keller, Joseph D. McColskey
Tensile properties of electron-beam-deposited free-standing aluminum thin films were measured. High ς y and UTS were observed, mainly due to fine grain sizes, consistent with values reported in the literature. The observed Young's modulus, as measured by

Abstracts for the MSEL Assessment Panel, March 2001

January 26, 2001
Author(s)
Leslie E. Smith, Alamgir Karim, Leonid A. Bendersky, C Lu, J J. Scott, Ichiro Takeuchi, Kathleen M. Flynn, Vinod K. Tewary, Davor Balzar, G A. Alers, Stephen E. Russek, Charles C. Han, Haonan Wang, William E. Wallace, Daniel A. Fischer, K Efimenko, Wen-Li Wu, Jan Genzer, Joseph C. Woicik, Thomas H. Gnaeupel-Herold, Henry J. Prask, Charles F. Majkrzak, Norman F. Berk, John G. Barker, Charles J. Glinka, Eric K. Lin, Ward L. Johnson, Paul R. Heyliger, David T. Read, R R. Keller, J Blendell, Grady S. White, Lin-Sien H. Lum, Eric J. Cockayne, Igor Levin, C E. Johnson, Maureen E. Williams, Gery R. Stafford, William J. Boettinger, Kil-Won Moon, Daniel Josell, Daniel Wheeler, Thomas P. Moffat, W H. Huber, Lee J. Richter, Clayton S. Yang, Robert D. Shull, R A. Fry, Robert D. McMichael, William F. Egelhoff Jr., Ursula R. Kattner, James A. Warren, Jonathan E. Guyer, Steven P. Mates, Stephen D. Ridder, Frank S. Biancaniello, D Basak, Jon C. Geist, Kalman D. Migler
Abstracts relating to research and development in the NIST Materials Science and Engineering Laboratory (MSEL) are presented for a poster session to be presented to the 2001 MSEL Assessment Panel.

Microstructural and Mechanical Characterization of Electrodeposited Gold Films

January 1, 2001
Author(s)
G J. Long, David T. Read, Joseph D. McColskey, K Crago
The effects of temperature and duration of thermal treatments on the microstructure and mechanical properties of electrodeposited gold films were evaluated. Specimens were synthesized by electrodeposition of gold on copper foil substrates followed by

Cross Comparison of Direct Strength Testing Techniques on Polysilicon Films

November 1, 2000
Author(s)
D A. LaVan, T Tsuchiya, G Coles, W G. Knauss, I Chasiotis, David T. Read
Several direct and indirect testing techniques to characterize the strength and distribution in strength of structural thin films have been developed with widely varying results appearing in the literature (roughly 1 to 4 GPa for polysilicon). Much of the

Tensile Testing Low Density Multilayers: Aluminum/Titanium

October 1, 1998
Author(s)
Daniel Josell, D van Heerden, D Shechtman, David T. Read
Yield stresses, ultimate tensile strengths, and specific strengths of aluminum/Titanium multilayer thin films are determined from the results of uniaxial tensile tests. The plasticity in the stress-strain curves. The nature of the fracture surfaces, and