COMPARISON OF TEXTURE IN COPPER AND ALUMINUM THIN FILMS AS DETERMINED BY XRD AND EBSD

Published

October 2, 2006

Author(s)

Jens Mueller, Davor Balzar, Roy H. Geiss, David T. Read, Robert Keller

Abstract

Texture in materials has a large influence on many properties of thin films; it is customarily determined by neutron or X-ray diffraction by measuring pole figures and evaluating orientation-distribution functions (ODF). X-ray diffraction (XRD) was the primary method for the characterization of texture for many years. Recently, alternative techniques for localized measurements have been developed, such as electron backscatter diffraction (EBSD), a method that offers a highly flexible tool to measure grain sizes, grain size distributions and orientation maps, in order to bring the characterization of texture to the nanoscale level. In this study, we compared measurements taken with XRD and EBSD for several selected cases of aluminum and copper thin films. However, we found that results obtained by both methods do no not necessarily agree for the same sample. In the present paper, we highlight some possible error sources and differences between these two techniques.

Proceedings Title

Advances in X-Ray Analysis

Conference Dates

August 1-5, 2005

Conference Location

Colorado Springs, CO, USA

Conference Title

Applications of X-Ray Analysis Conf.

Pub Type

Conferences

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Keywords

copper, EBSD, self annealing, texture measurements, XRD

Citation

Mueller, J. , Balzar, D. , Geiss, R. , Read, D. and Keller, R. (2006), COMPARISON OF TEXTURE IN COPPER AND ALUMINUM THIN FILMS AS DETERMINED BY XRD AND EBSD, Advances in X-Ray Analysis, Colorado Springs, CO, USA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50205 (Accessed October 16, 2025)