NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.
Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.
An official website of the United States government
Here’s how you know
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
David T. Read, Yi-Wen Cheng, Joseph D. McColskey, R R. Keller
Abstract
Here we report the results of tensile tests of thin films of Al-0.5 % Cu deposited on bare silicon. This material was on a wafer that was subjected to the complete CMOS fabrication process, tensile strength, and elongation were all lower than the corresponding values found previously for pure electron-beam-evaporated aluminum films. The strengths and elongation decreased slightly as the specimen temperature was raised from 25 to 150 'C. The slopes of the stress-straincurves from unloading-reloading runs were lower than the handbook Young's modulus of aluminum. The results are interpreted with the help of scanning and transmission electron microscopy.
Proceedings Title
Thin Films: Stresses and Mechanical Properties, Symposium FF | | Thin Films: Stresses and Mechanical Properties IX | Materials Research Society
Volume
695
Conference Dates
November 26-30, 2001
Conference Title
Materials Research Society Symposium Proceedings
Pub Type
Conferences
Keywords
CMOS, ductility, elongation, grain size, strain, strength, stress, thin film
Citation
Read, D.
, Cheng, Y.
, McColskey, J.
and Keller, R.
(2003),
Mechanical Behavior of Contact Aluminum Alloy, Thin Films: Stresses and Mechanical Properties, Symposium FF | | Thin Films: Stresses and Mechanical Properties IX | Materials Research Society
(Accessed October 13, 2025)