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Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures



David T. Read, Yi-Wen Cheng, Roy H. Geiss


The temperature dependence of the strength of a thin copper electrodeposit has been measured from room temperature to 150 °C by microtensile testing. The ultimate tensile strength decreased from around 240 MPa at room temperature to just above 200 MPa at 150 °C. The yield strength followed a similar trend. Elongation to failure increased slightly with temperature. The Young's modulus, as measured by the unload-load slope, was well below the values expected based on averaging single- crystal elastic constants at all test temperatures. The strain rate effect on strength at room temperature, using a range of over a decade, was low, with a weak trend upward.
Proceedings Title
Proc. Intl. Mechanical Engineering Conf.
Conference Dates
November 13-19, 2004
Conference Location
Anaheim, CA, USA
Conference Title
Intl. Mechanical Engineering Conf.


grain size, strain rate, strength, ultimate strength, yield strength


Read, D. , Cheng, Y. and Geiss, R. (2004), Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures, Proc. Intl. Mechanical Engineering Conf., Anaheim, CA, USA, [online], (Accessed June 17, 2024)


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Created November 18, 2004, Updated October 12, 2021