Read, D.
, Cheng, Y.
and Geiss, R.
(2004),
Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures, Proc. Intl. Mechanical Engineering Conf., Anaheim, CA, USA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50059
(Accessed March 13, 2025)
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Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures
Published
Author(s)
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Abstract
The temperature dependence of the strength of a thin copper electrodeposit has been measured from room temperature to 150 °C by microtensile testing. The ultimate tensile strength decreased from around 240 MPa at room temperature to just above 200 MPa at 150 °C. The yield strength followed a similar trend. Elongation to failure increased slightly with temperature. The Young's modulus, as measured by the unload-load slope, was well below the values expected based on averaging single- crystal elastic constants at all test temperatures. The strain rate effect on strength at room temperature, using a range of over a decade, was low, with a weak trend upward.Proceedings Title
Proc. Intl. Mechanical Engineering Conf.
Conference Dates
November 13-19, 2004
Conference Location
Anaheim, CA, USA
Conference Title
Intl. Mechanical Engineering Conf.
Pub Type
Conferences
Download Paper
Keywords
grain size, strain rate, strength, ultimate strength, yield strength
Citation
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Created November 18, 2004, Updated October 12, 2021