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Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures

Published

Author(s)

David T. Read, Yi-Wen Cheng, Roy H. Geiss

Abstract

The temperature dependence of the strength of a thin copper electrodeposit has been measured from room temperature to 150 °C by microtensile testing. The ultimate tensile strength decreased from around 240 MPa at room temperature to just above 200 MPa at 150 °C. The yield strength followed a similar trend. Elongation to failure increased slightly with temperature. The Young's modulus, as measured by the unload-load slope, was well below the values expected based on averaging single- crystal elastic constants at all test temperatures. The strain rate effect on strength at room temperature, using a range of over a decade, was low, with a weak trend upward.
Proceedings Title
Proc. Intl. Mechanical Engineering Conf.
Conference Dates
November 13-19, 2004
Conference Location
Anaheim, CA, USA
Conference Title
Intl. Mechanical Engineering Conf.

Keywords

grain size, strain rate, strength, ultimate strength, yield strength

Citation

Read, D. , Cheng, Y. and Geiss, R. (2004), Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures, Proc. Intl. Mechanical Engineering Conf., Anaheim, CA, USA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50059 (Accessed June 17, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created November 18, 2004, Updated October 12, 2021