Read, D.
, Cheng, Y.
and Geiss, R.
(2004),
Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures, Proc. Intl. Mechanical Engineering Conf., Anaheim, CA, USA, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50059
(Accessed June 1, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures
Published
Author(s)
, ,
Abstract
The temperature dependence of the strength of a thin copper electrodeposit has been measured from room temperature to 150 °C by microtensile testing. The ultimate tensile strength decreased from around 240 MPa at room temperature to just above 200 MPa at 150 °C. The yield strength followed a similar trend. Elongation to failure increased slightly with temperature. The Young's modulus, as measured by the unload-load slope, was well below the values expected based on averaging single- crystal elastic constants at all test temperatures. The strain rate effect on strength at room temperature, using a range of over a decade, was low, with a weak trend upward.Proceedings Title
Proc. Intl. Mechanical Engineering Conf.
Conference Dates
November 13-19, 2004
Conference Location
Anaheim, CA, USA
Conference Title
Intl. Mechanical Engineering Conf.
Pub Type
Conferences
Download Paper
Keywords
grain size, strain rate, strength, ultimate strength, yield strength
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created November 18, 2004, Updated October 12, 2021