TY  - CONF
AU  - Read, David
AU  - Cheng, Yi-Wen
AU  - Geiss, Roy
C2  - Proc. Intl. Mechanical Engineering Conf., Anaheim, CA, USA
DA  - 2004-11-19 00:11:00
LA  - en
PB  - Proc. Intl. Mechanical Engineering Conf., Anaheim, CA, USA
PY  - 2004
TI  - Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures
UR  - https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=50059
ER  -