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Displaying 476 - 500 of 1445

Novel Charge Pumping Method Applied to Tri-Gate MOSFETs for Reliability Characterization

January 14, 2016

Author(s)

Brad Bittel, S Novak, Steve Ramey, S Padiyar, Jason Ryan, Jason Campbell, Kin P. Cheung

Dataset for the Validation and use of DiameterJ an Open Source Nanofiber Diameter Measurement Tool

January 1, 2016

Author(s)

Nathan A. Hotaling, Kapil Bharti, Hayden Kriel, Carl G. Simon Jr.

DiameterJ is an open source image analysis plugin for ImageJ. DiameterJ produces ten files for every image that it analyzes. These files include the images that were analyzed, the data to create histograms of fiber radius, pore size, fiber orientation, and

Polarity-Controlled GaN/AlN Nucleation Layers for Selective-Area Growth of GaN Nanowire Arrays on Si(111) Substrates by Molecular Beam Epitaxy

December 18, 2015

Author(s)

Matthew D. Brubaker, Shannon M. Duff, Todd E. Harvey, Paul T. Blanchard, Alexana Roshko, Aric W. Sanders, Norman A. Sanford, Kristine A. Bertness

We have demonstrated dramatic improvement in the quality of selective-area GaN nanowire growth by controlling the polarity of the underlying nucleation layers. In particular, we find that N- polarity is beneficial for the growth of large ordered nanowire

In situ spectroscopic study of the plastic deformation of amorphous silicon under non-hydrostatic conditions

December 17, 2015

Author(s)

Yvonne B. Gerbig, Chris A. Michaels, Robert F. Cook, Jodie E. Bradby

Indentation-induced plastic deformation of amorphous silicon (a-Si) thin films was studied by in situ Raman imaging of the deformed contact region of an indented sample, employing a Raman spectroscopy-enhanced instrumented indentation technique (IIT). The

Subsurface Imaging of Ungrounded Metal Lines Embedded in Dielectric with the Scanning Microwave Microscope

December 17, 2015

Author(s)

Lin You, Jungjoon Ahn, Yaw S. Obeng, Joseph Kopanski

We demonstrate the ability of the scanning microwave microscope (SMM) to measure the subsurface location of ungrounded. 1.2-μm wide metal lines embedded in a dielectric film. The SMM was used to image Al-Si-Cu metal lines in a test chip that were

Models for Low Energy Electron Beam Induced Current Experiments in polycrystalline thin film photovoltaics

December 16, 2015

Author(s)

Paul M. Haney, Heayoung Yoon, Rob Collins, Prakash Koirala, Nikolai Zhitenev

Electron beam induced current (EBIC) is a powerful technique which measures the charge collection efficiency of electron-hole pairs generated by an electron beam. EBIC offers sub-micron spatial resolution and is naturally suited to study polycrystalline

High-performing visible-blind photodetectors based on SnO2/CuO nanoheterojunctions

December 14, 2015

Author(s)

Ratan K. Debnath, Ting Xie, MD R. Hasan, Nhan V. Nguyen, Abhishek Motayed

We report on the significant performance enhancement of SnO2 thin film ultraviolet (UV) photodetectors (PDs) through incorporation of CuO/SnO2 pn nanoscale heterojuctions. The nanoheterojunctions are self-assembled by sputtering Cu clusters that oxidize in

Oriented Liquid Crystalline Polymer Semiconductor Films with Large Ordered Domains

December 9, 2015

Author(s)

Xiao Xue, George Chandler, Xinran Zhang, Regis J. Kline, Martin Heeney, Pete Diemer, Oana Jurchescu, Brendan T. O'Connor

Reliability Characterization of Au-In Transient Liquid Phase Bonding through Electrical Resistivity Measurement

November 19, 2015

Author(s)

Brian J. Grummel, Habib A. Mustain, Z. J. Shen, Allen R. Hefner Jr.

Transient liquid phase (TLP) bonding has shown to be an attractive die-attach material and solder for high-temperature packaging. The material reliability of Au-In TLP has been investigated in this work utilizing electrical resistivity measurement as an

Deep-subwavelength Nanometric Image Reconstruction using Fourier Domain Optical Normalization

November 5, 2015

Author(s)

Jing Qin, Richard M. Silver, Bryan M. Barnes, Hui Zhou, Ronald G. Dixson, Mark Alexander Henn

Quantitative optical measurements of deep sub-wavelength, three-dimensional, nanometric structures with sensitivity to sub-nanometer details address an ubiquitous measurement challenge. A Fourier domain normalization approach is used in the Fourier optical

Making Contact to Molecular Layers: Linking Large Ensembles of Molecules to the Outside World

November 4, 2015

Author(s)

Christina A. Hacker, Sujitra J. Pookpanratana, Curt A. Richter, Mariona Coll

In this chapter we examine the various approaches to making electrical contact to large area molecular junctions. We will highlight the experimental concerns that one must consider and the various approaches to make reliable structures and characterize the

Lateral Tip Control Effects in CD-AFM Metrology: The Large Tip Limit

October 21, 2015

Author(s)

Ronald G. Dixson, Ryan Goldband, Ndubuisi G. Orji

Critical dimension atomic force microscopes (CD-AFMs) use flared tips and two-dimensional sensing and control of the tip-sample interaction to enable scanning of features with near-vertical or even reentrant sidewalls. Features of this sort are commonly

Dielectric Spectroscopic Detection of Early Failures in 3-D Integrated Circuits

October 11, 2015

Author(s)

Yaw S. Obeng, Chukwudi A. Okoro, Jungjoon Ahn, Lin You, Joseph J. Kopanski

The commercial introduction of three dimensional integrated circuits (3D-ICs) has been hindered by reliability challenges, such as stress related failures, resistivity changes, and unexplained early failures. In this paper, we discuss a new RF-based