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Conferences

A Model System for Interfacial Reactions in LTCC Materials

Author(s)
Lawrence P. Cook, Winnie K. Wong-Ng, Peter K. Schenck, Mark D. Vaudin, J Suh
Over the past decade, ceramic packaging materials have continued to increase in both chemical and structural complexity. At processing temperatures of 800 C to

XML for Exchange of Weld Inspection Results

Author(s)
William G. Rippey, Timothy P. Quinn, John L. Michaloski
TECHNICAL SUMMARYIntroduction/Background SectionA system to demonstrate the transfer of weld inspection data between computer programs is described in this

Multichannel Decomposition of Heptyl Radicals

Author(s)
Wing Tsang, Iftikhar A. Awan, Jeffrey A. Manion
This paper is concerned with decomposition of heptyl radicals in high temperature combustion environments. Experimental results on the decomposition of n-heptyl

The NIST Microforce Realization and Measurement Project

Author(s)
David B. Newell, Edwin R. Williams, John A. Kramar, Jon R. Pratt, Douglas T. Smith
The National Institute of Standards and Technology (NIST) has launched a five-year Micro-force Realization and Measurement project focusing on the development

Composite Substrate Research for Large-format HgCdTe IRFPAs

Author(s)
N. K. Dhar, Y Chen, P M. Brill, Paul M. Amirtharaj, S Velicu, P Boieriu, Anthony G. Birdwell
Research on silicon based composite substrates is being conducted at the Army Research Laboratory. These substrates can be used to deposit HgCdTe alloys to

Metrology for Molecular Electronics

Author(s)
Curt A. Richter, D R. Stewart
We discuss some of the complex issues associated with the metrology of molecular electronic devices and describe an electrical characterization method to assess
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