Multivariant Measurement for Thin Film Adhesion as a Function of Temperature and Thin Film Thickness

Published

May 1, 2003

Author(s)

Martin Y. Chiang, R Song, Alamgir Karim, Eric J. Amis

Abstract

The next generation of electronic components will require new low-k dielectrics or other novel thin films in the sub-micron level to be integrated into their construction. In developing these new materials, it is important to assess the adhesion reliability between film and substrate in a fast, practical and reproducible fashion. This study is to develop a high-throughput multivariant (combinatorial) approach to the edge delamination test to map the interfacial failure of the film as a function of both temperature and film thickness in a single step to provide the information of adhesion reliability. A simulation result and an initial experimental observation are presented to demonstrate the feasibility of the approach. This approach provides a vehicle for combinatorial assessment of adhesion that can speed the pace of material innovations.

Proceedings Title

Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show | | |

Volume

19(7)

Conference Dates

February 1, 2003

Conference Title

Nanotech 2003

Pub Type

Conferences

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Keywords

adhesion, combinatorial multivarient approach, edge delamination, fracture mechanics finite ele, interfacial debonding, thin film

Citation

Chiang, M. , Song, R. , Karim, A. and Amis, E. (2003), Multivariant Measurement for Thin Film Adhesion as a Function of Temperature and Thin Film Thickness, Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show | | |, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852168 (Accessed May 2, 2024)