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Monitoring Polymer/Clay Nanocomposites Compounding Using a Dielectric Slit Die

Published

Author(s)

Anthony J. Bur, S C. Roth, M M. McBrearty

Abstract

A new in-line process monitoring instrument, a dielectric slit die, was used to examine compounding of polymer/clay nanocomposites. It is a multi-purpose sensing device for measuring polymer dielectric, rheological and optical properties during extrusion. We report the results of compounding nylon 12 and polyethylene ethylvinyl acetate copolymer with organo modified clays. We show that ionic conductivity is a major contributor to the dielectric loss at high processing temperatures. Curve fitting of the dielectric loss as function of frequency allows us to separate loss due to DC conductivity and dielectric dispersion loss.
Proceedings Title
Proceedings of the Annual Technical Meeting of the Society of Plastics Engineers
Volume
19(8)
Conference Dates
May 1, 2003
Conference Title
Society of Plastics Engineers. Technical Meeting

Keywords

dielectric properties, extrusion compounding, nanocomposites, optical properties, polymer processing, rheological properties, slit die

Citation

Bur, A. , Roth, S. and McBrearty, M. (2003), Monitoring Polymer/Clay Nanocomposites Compounding Using a Dielectric Slit Die, Proceedings of the Annual Technical Meeting of the Society of Plastics Engineers, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=852149 (Accessed April 16, 2024)
Created May 30, 2003, Updated February 19, 2017