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Notice of Funding Opportunity: CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development
This funding opportunity is closed
The CHIPS NAPMP has finalized a total of $300 million under the CHIPS NAPMP’s first Notice of Funding Opportunity (NOFO) for advanced substrates and material research.
Awardees
Absolics, Inc. in Covington, Georgia, $100 million in direct funding: This award will support Absolics’ Substrate and Materials Advanced Research and Technology (SMART) Packaging Program and help build a glass-core packaging ecosystem. Absolics’ glass substrates will be used as an important advanced packaging technology to increase the performance of leading-edge chips for artificial intelligence (AI), high-performance compute and data centers by reducing power consumption and system complexity. Learn more about the CHIPS NAPMP Materials and Substrates award here.
Applied Materials, Inc. in Santa Clara, California, $100 million in direct funding: This project will develop and scale a disruptive silicon-core substrate technology for next-generation advanced packaging and 3D heterogeneous integration. Applied Materials’ silicon-core substrate technology has the potential to advance America’s leadership in advanced packaging and help catalyze an ecosystem to develop and build next-generation energy-efficient artificial intelligence (AI) and high-performance computing systems in the U.S. Learn more about the CHIPS NAPMP Materials and Substrates award here.
Arizona State University in Tempe, Arizona, $100 million in direct funding: The award will support the development of the next generation of microelectronics packaging through fan-out-wafer-level-processing (FOWLP). Centered at ASU Advanced Electronics and Photonics Core Facility, this project supports ASU’s research in exploring the commercial viability of 300 mm wafer-level and 600 mm panel-level manufacturing, a technology that does not exist as a commercial capability in the U.S. today.
Learn more about the CHIPS NAPMP Materials and Substrates award here.
On February 28, 2024, CHIPS for America issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. The CHIPS for America program anticipates approximately $300 million in funding innovation across multiple technologies ranging from semiconductor-based to glass and organics. This is the first NOFO released by the CHIPS for America R&D program office, and the third NOFO released overall by CHIPS for America.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Funding Opportunity
Read the full text of the funding opportunity (PDF) for more information.
FAQ: CHIPS R&D Research Security and Technology Protection (PDF)
FAQ: International Engagement in CHIPS R&D Programs (PDF)
Additional Frequently Asked Questions
CHIPS Technology Protection Guidebook (PDF)
CHIPS R&D Commercial Viability and Domestic Production (CVDP) Plan Guidebook (PDF)
NAPMP NOFO 1 Concept Paper Review Process Overview (PDF)
Read more on the vision for the CHIPS NAPMP.
CHIPS NAPMP Funding Opportunity Application Process:
Through this NOFO, the NAPMP program seeks to achieve the following objectives:
- Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
- Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security;
- Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
- Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.
There are two main components to this application:
Mandatory Concept Paper: Applicants will be asked to submit a concept paper. Concept papers were due on April 12, 2024.
- Eligible applicants can only submit one concept plan paper under this NOFO.
- No entity may be included as a subrecipient on more than two concept papers.
- Concept plans received after the deadline will not be reviewed or considered.
Full Application Process: Full proposals were due July 3, 2024.
- Full applications will only be accepted from applicants who were invited to submit a full application after review of their mandatory concept paper.
Additional resources for the advanced packaging substrates and substrate materials funding opportunity:
Learn about additional CHIPS for America R&D funding opportunities.