Projects/Programs

Displaying 1 - 25 of 30

Accurate Cure Kinetics, Stress, Mechanical Properties and Warpage

Ongoing

Advanced packaging involves increasingly challenging requirements for heterogeneous integration and chiplet packaging. Needs such as fine pitch interconnects (

Advanced Analytical Electron Tomography for Materials Development and Failure Analysis in Semiconductor Devices

Ongoing

Transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) are widely used in industry for identifying structural and

Advanced Metrology to Enable Next Generation EUV Photoresists

Ongoing

The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme

Advancing Power Electronics with Defect Metrology

Ongoing

The exponential growth in the power electronics market requires efficient devices based on wide bandgap (WBG) semiconductors. The yield of power devices is

Atom Probe Tomography: Nanostructured Semiconductor Materials, Interfaces, and Devices

Ongoing

The semiconductor industry requires sub-nanometer, 3-dimensional quantitative elemental mapping of materials, nanoscale structures, and devices with high

a conceptual diagram of a gate-all-around (GAA) field-effect transistor

Causal Green's function simulations of phonons for multiscale/multiphysics modeling of thermal transport in gate-allaround transistors

Ongoing

This project employs a causal Green’s function (CGF) method to model thermal transport in nanoscale semiconductors, overcoming limitations posed by the Fourier

RF Channel Propagation Measurements and Models for Communications Circuits

Ongoing

An accurate characterization of how the wireless signal propagates through different environments and frequency bands, is key to developing radio frequency (RF)

Characterization of Nano-to-Microscale Process-Induced Thermo-Mechanical Changes in Heterogeneously Integrated Microelectronics

Ongoing

Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and

Diagram of the CDSAXS method, shows an x-ray beam going through a sample and onto an e-ray detector.

Critical Dimension Small Angle X-Ray Scattering (CDSAXS) for Next Generation in-line Metrology

Ongoing

The semiconductor industry is in need of new, high throughput in-line dimensional metrology methods to characterize next generation 3D nanostructures. The

Dynamic EUV Metrology of Nanoscopic Thermal Transport in Active Devices

Ongoing

An urgent objective of the microelectronics industry is to mitigate the extreme heat densities generated within devices that are limiting the performance of

Electro-acoustic Metrology of Piezoelectric Materials for Wireless Communications

Ongoing

Microwave acoustic resonators are widely used to filter signals on multiple frequency bands for mobile communications. To predict filter performance, industry

Electron-Solid Interactions

Ongoing

Fundamental understanding of electron-solid interactions is key to interpreting electron microscopy images for quantitative metrology. Scanning electron

EUV Scatterometry

Ongoing

The state of the art for measurement and inspection of the smallest printed features on an integrated circuits (IC) chip is a combination of electron scanning

Today, device performance needs to be evaluated to determine success of materials development. This project will advance metrology for magnetic materials and develop models to predict device performance.

High Speed Metrology for Magnetoelectronic Devices and Models

Ongoing

Ferromagnet-based microelectronic devices play an increasingly important role within the semiconductor ecosystem. Magnetic RAM (MRAM) is already replacing

Mapping of Thermal Properties at the Nanoscale

Ongoing

Precise measurements of thermal properties at the nanoscale are needed to engineer advanced and heterogeneously integrated devices, but measurements at this

A line drawing of a woman's head styled like a classical carved bust

METIS

Ongoing

A new publication describes METIS, a Metrology Exchange to Innovate in Semiconductors We are seeking comments on the draft publication through February 16, 2024

RF Metrology for High-Frequency Transistor Models

Ongoing

Advanced semiconductor technology has led to continuous performance improvements in transistors. However, many iterations are needed to obtain optimal

Metrology for Integration of New Magnetic Materials

Ongoing

Electromagnetic (EM) systems use magnetic components such as inductors, isolators, and adaptive filters, but these are currently bulky and difficult to

Metrology of Materials, Surfaces, and Processes for Hybrid Advanced Packaging

Ongoing

Advanced bonding and integration physically bring together components, devices, and materials that are produced separately. There are strong economic and

Molecular Dynamics Simulation of Heat Transport in Gate-All-Around Transistors

Ongoing

Heat management in semiconductor devices is a crucial problem currently limiting device performance and essentially all progress involving reduction of device

Multiscale Modeling and Validation of Semiconductor Materials and Devices

Ongoing

A comprehensive understanding of how current and next-generation materials impact the performance of semiconductor devices is critical to U.S. Semiconductor

Nanocalorimetry for Semiconductors and Semiconductor Process Metrology

Ongoing

Advanced methods to measure the thermal properties of thin films and interfaces are required to understand and improve microelectronic device fabrication

Nanoscale, Element-Specific X-ray Imaging for Integrated Circuit Metrology

Ongoing

A current lack of 3D characterization tools that meet semiconductor industry needs is hampering manufacturing fidelity and supply chain security. Developing new

Non-Destructive Semiconductor Structure Function and Process Optimization for future Microelectronics Manufacturing at the NIST NSLS-II Beamline for XAFS and Diffraction

Ongoing

NIST Synchrotron beamline characterization of advanced semiconductor materials structure, chemical, electronic, and strain properties has been an ongoing

Overcoming Barriers: Nanoscale Interface Metrology and Electrical Characterization for Advanced Electronics

Ongoing

As devices become smaller, more complex, and more highly integrated, interfaces are increasingly important and limiting. The ability to accurately predict

Advanced communications
-Open Radio Access Network (Open-RAN)
-Quantum communications
-Spectrum sharing
-Wireless (RF)
Bioscience
-Bioinformatics
-Biomanufacturing
-Biomaterials
-Cell biology
-Engineering / synthetic biology
-Genomics
-Glycomics
-Metabolomics
-Microbial measurements
-Proteomics
Buildings and Construction
-Building codes and standards
-Building control systems
-Building damage and repair
-Building economics
-Building materials
-Energy efficiency
-Heating, ventilation and air conditioning equipment
-Indoor air quality
-Structural engineering
-Thermal comfort
Chemistry
-Analytical chemistry
-Chemical engineering and processing
-Chemical thermodynamics and chemical properties
-Molecular characterization
-Theoretical chemistry and modeling
-Thermochemical properties
Electronics
-Electromagnetics
-Flexible electronics
-Magnetoelectronics
-Optoelectronics
-Organic electronics
-Semiconductors
-Sensors
-Superconducting electronics
Energy
-Alternative energy
-Conventional energy
-Electric power / smart grid
-Fuels
Environment
-Air / water / soil quality
-Climate
-Environmental health
-Greenhouse gas measurements
-Marine science
-Sustainability
Fire
-Emergency building evacuation
-Fire detection
-Fire dynamics and science
-Fire fighting
-Fire modeling
-Fire risk reduction
-Materials flammability
-Structural fire resistance
-Wildland urban interface fire
Forensic Science
-Digital evidence
-Drugs and toxicology
-Firearms and toolmarks
-Forensic biometrics
-Forensic genetics
-Trace evidence
Health
-Biopharmaceuticals
-Clinical diagnostics
-Dentistry
-Food and nutrition
-Medical imaging
-Precision medicine
-Regenerative medicine and advanced therapy
Information technology
-Artificial intelligence
--AI measurement and evaluation
--Applied AI
--Fundamental AI
--Hardware for AI
--Machine learning
--Trustworthy and responsible AI
-Biometrics
-Cloud computing and virtualization
-Complex systems
-Computational science
-Conformance testing
-Cyber-physical systems
--Smart cities
-Cybersecurity
--Cryptography
--Cybersecurity education and workforce development
--Cybersecurity measurement
--Identity and access management
--Privacy engineering
--Risk management
--Securing emerging technologies
--Trustworthy networks
--Trustworthy platforms
-Data and informatics
--Human language technology
--Information retrieval
--Natural language processing
-Federal information processing standards (FIPS)
-Health IT
-Internet of Things (IoT)
-Interoperability testing
-Location based services
-Mobile
-Networking
--Mobile and wireless networking
--Network management and monitoring
--Network modeling and analysis
--Network security and robustness
--Network test and measurement
--Next generation networks
--Protocol design and standardization
--Software defined and virtual networks
-Privacy
-Software research
--Software testing
-Usability and human factors
--Accessibility
-Video analytics
-Virtual / augmented reality
-Visualization research
-Voting systems
Infrastructure
Manufacturing
-Additive manufacturing
-Factory communications
-Factory operations planning and control
-Interoperability in manufacturing
-Machining
-Manufacturing economics
-Manufacturing systems design and analysis
-Monitoring, diagnostics and prognostics
-Process improvement
-Process measurement and control
-Product data
-Quality assurance
-Robotics in manufacturing
--Agility and adaptability
--Collaborative robots
--Dexterous grasping
--Manipulation
--Mobility and industrial autonomous vehicles
--Navigation / actuation / control
--Sensing and perception
-Supply chain
-Sustainable manufacturing
-Systems engineering
-Systems integration
-Technology commercialization
Materials
-Ceramics
-Composites
-Concrete / cement
-Materials characterization
--Composition and structure
--Mechanical properties
--Thermal properties
-Metals
-Modeling and computational material science
-Polymers
-Superconductors
Mathematics and statistics
-Experiment design
-Image and signal processing
-Modeling and simulation research
-Numerical methods and software
-Statistical analysis
-Uncertainty quantification
Metrology
-Amount of substance
-Dimensional metrology
-Electrical / electromagnetic metrology
-Flow metrology and rheology
-Force metrology
-Humidity metrology
-Ionizing radiation metrology
-Mass metrology
-Metric
-Optical / photometry / laser metrology
-Pressure and vacuum metrology
-Thermometry metrology
-Time and frequency metrology
-Weights and measures
Nanotechnology
-Nanobiotechnology
-Nanochemistry
-Nanoelectronics
-Nanofabrication / manufacturing
--Lithography
--Self-assembly
-Nanofluidics
-Nanomagnetics
-Nanomaterials
-Nanomechanics
-Nanometrology
-Nanophotonics
-Nanophysics
-Nanoplasmonics
Neutron research
Performance excellence
-Assessment tools and services
-Baldrige award
-Baldrige examiners
-Baldrige Framework and Criteria
-Best practices
-Leadership development
Physics
-Atomic / molecular / quantum
-Biological physics
-Condensed matter
-Electron physics
-Magnetics
-Nuclear physics
-Optical physics and communications
-Quantum information science
-Radiation
-Spectroscopy
-Thermodynamics
-Time and frequency
Public safety
-Chemical / Biological / Radiological / Nuclear / Explosives (CBRNE)
-First responder preparedness
-Law enforcement
-Public safety communications research
-Response robots
Resilience
-Community resilience
-Disaster and failure studies
-Earthquake risk reduction
-Resilience economics
-Resilient materials
-Windstorm impact reduction
Standards
-Accreditation
-Calibration services
-Conformity assessment
-Documentary standards
-Frameworks
-Reference data
-Reference instruments
-Reference materials
-Standards education
Transportation
-Aerospace
-Automotive