CHIPS for America Awards

The CHIPS for America award will provide Texas Instruments Sherman, Texas up to $900 million in total direct funding under the CHIPS and Science Act to support the construction of two new, large-scale 300-mm fabrication facilities that are expected to produce 65nm – 130nm analog and embedded processing semiconductors, with anticipated production capacity of tens of millions chips every day. The Sherman site is one of the only greenfield production sites for current-generation and mature-node chips on 300-mm wafers in the U.S.

The CHIPS for America award will provide Texas Instruments Lehi, Utah up to $700 million in total direct funding under the CHIPS and Science Act to support the construction of a new, large-scale 300-mm fabrication facility to produce 28nm – 65nm analog and embedded processing semiconductors, which is anticipated to produce tens of millions of chips every day. This project represents the largest economic investment in Utah’s history.

The CHIPS for America investment in SK Hynix of up to $458 million in direct funding under the CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging fabrication and research and development (R&D) facility.

The CHIPS for America award will provide GlobaWafers with $380 million in direct funding under the CHIPS and Science Act to support the construction of a 300mm silicon wafer manufacturing facility for all chips, including leading-edge, mature-node, and memory chips.

The CHIPS for America award will provide GlobaWafers with $20 million in direct funding under the CHIPS and Science Act to support the construction of a 300mm silicon-on-insulator (SOI) wafer-manufacturing facility, critical for advanced semiconductor applications.

The CHIPS for America award will provide Micron New York direct funding under the CHIPS and Science Act to support construction of the first two fabs of planned four fab “megafab” focused on leading-edge DRAM chip production. Each fab will have 600,000 square feet of cleanrooms, totaling 2.4 million square feet of cleanroom space across the four facilities—the largest amount of cleanroom space ever announced in the United States and the size of nearly 40 football fields.

The CHIPS for America award will provide Micron Boise Idaho direct funding under the CHIPS and Science Act to support the development of two high-volume manufacturing (HVM) fabs, with approximately 600,000 square feet of cleanroom space focused on the production of leading-edge DRAM chips. The fabs would be co-located with the company’s R&D facility to improve efficiency across their R&D and manufacturing operations, reducing lags in technology transfer and cutting time-to-market for leading-edge memory products.

The CHIPS for America award will provide Absolics up to $75 million in total direct funding under the CHIPS and Science Act to support the construction of a 120,000 square-foot facility in Covington, Georgia and the development of substrates technology for use in semiconductor advanced packaging.

The CHIPS for America award will provide Entegris up to $77 million in total direct funding under the CHIPS and Science Act to support the construction of its state-of-the-art manufacturing center in Colorado Springs. The center is being built in multiple phases: the first to support production of FOUPs — which are currently entirely produced abroad — and liquid filter membranes, and the second phase to support the production of advanced liquid filters and purifiers as well as fluid handling solutions. In addition to the manufacturing center, Entegris is also committed to further expanding their R&D capabilities in the United States by the end of the decade.

The CHIPS for America award will provide Intel New Mexico up to $500 million in total direct funding under the CHIPS and Science Act to support the modernization of two existing fabs into an advanced packaging facility to close an important gap in the domestic semiconductor supply chain.

The CHIPS for America award will provide Intel Arizona up to $3.94 billion in total direct funding under the CHIPS and Science Act to support the construction of two new leading-edge logic fabs and modernization of one existing fab, significantly increasing leading-edge logic capacity, including high volume domestic production of Intel 18A – the company’s most advanced chip design that enables higher performing, leading-edge chips through RibbonFET gate-all-around transistors and PowerVia backside power delivery.

The CHIPS for America award will provide Intel Oregon up to $1.86 billion in total direct funding under the CHIPS and Science Act to support the investment in the premier hub of leading-edge research and development in the United States through the expansion and modernization of technology development facilities that will utilize the world’s first commercial High-NA EUV lithography equipment.

The CHIPS for America award will provide Intel Ohio up to $1.5 billion in total direct funding under the CHIPS and Science Act to support the creation of a new regional chipmaking ecosystem, anchored by a new leading-edge logic fab which will produce the Intel 14A node and other future Intel nodes and expand leading-edge foundry capacity.

The CHIPS for America award will provide BAE Systems up to $35.5 million in total direct funding under the CHIPS and Science Act to support a modernization project that will replace aging tools and quadruple the production of chips necessary for critical defense programs, including the $1.7 trillion F-35 fighter jet program.

The CHIPS for America award will provide Rocket Lab up to $23.9 million in total direct funding under the CHIPS and Science Act to support the creation of a more robust and resilient supply of space-grade solar cells that power spacecrafts and satellites. The modernization and expansion project would increase Rocket Lab’s compound semiconductor production by 50% within the next three years – helping to meet the growing national security and commercial demand for these solar cells in the United States.