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Develop a novel linear accumulation x-ray source to achieve an order of magnitude increase in performance over leading x-ray sources for critical dimension scattering. This project benefits researchers and manufacturers of semiconductor transistors.
Develop a transmission electron microscopy in-situ specimen holder that enables real-time imaging of nano-scale electronic devices. The project will benefit manufacturers and researchers of next-generation high-voltage power converters used in a wide variety of industries.
Develop hybrid atomic force microscopy instrument that will automatically generate maps of the thermal resistance, thermal boundary interface resistance, and temperature profiles of microprocessors and wide bandgap semiconductor materials and devices. This project will benefit devices with thermal management challenges and materials development needs on length scales smaller than 100 nanometers.
Develop an ultra-compact, ultra-low vibration cryogenic system to support time-resolved imaging applications. This project will benefit integrated circuit manufacturers and researchers conducting experiments on quantum technologies.
Develop next-generation large-signal and high-power transistor modeling techniques to create highly accurate models for Radio Frequency (RF)-Microwave circuit design simulators. This project will benefit researchers and U.S. manufacturers of advanced radar, communications, and satellite technologies.
Develop a new instrument for high-speed thermal properties analysis and simultaneous chemical characterization with sub-micron spatial resolution. This project will improve thermal management and thermal property characterization for the U.S. semiconductor industry.
Created September 6, 2024, Updated September 19, 2024