CHIPS for America Awards

This award aims to support Arizona State University in developing the next generation of microelectronics packaging through fan-out-wafer-level processing and exploring the commercial vitality of 300mm wafer-level and 600mm panel-level manufacturing.

The CHIPS for America award will provide Amkor Technology Peoria, Arizona up to $900 million in total direct funding under the CHIPS and Science Act to support the construction of a new advanced packaging and testing facility ensuring a reliable domestic advanced packaging ecosystem, supporting leading-edge clusters, and helping meet the growing demand for AI chips.

The CHIPS for America award will provide the company with up to $6.6 billion in total direct funding under the CHIPS and Science Act to support the company’s planned investment of more than $65 billion in three greenfield leading-edge fabs in Phoenix, Arizona.

The CHIPS for America award will provide Intel Arizona up to $3.94 billion in total direct funding under the CHIPS and Science Act to support the construction of two new leading-edge logic fabs and modernization of one existing fab, significantly increasing leading-edge logic capacity, including high volume domestic production of Intel 18A – the company’s most advanced chip design that enables higher performing, leading-edge chips through RibbonFET gate-all-around transistors and PowerVia backside power delivery.

Develop a novel high-speed camera for high-resolution electron backscatter diffraction and transmission Kikuchi diffraction which will significantly expand the materials properties that can be probed with this technique. This project will benefit U.S. industry using materials characterization for current and next-generation microelectronics devices.

Develop a new instrument for high-speed thermal properties analysis and simultaneous chemical characterization with sub-micron spatial resolution. This project will improve thermal management and thermal property characterization for the U.S. semiconductor industry.

Develop next-generation large-signal and high-power transistor modeling techniques to create highly accurate models for Radio Frequency (RF)-Microwave circuit design simulators. This project will benefit researchers and U.S. manufacturers of advanced radar, communications, and satellite technologies.

Develop an ultra-compact, ultra-low vibration cryogenic system to support time-resolved imaging applications. This project will benefit integrated circuit manufacturers and researchers conducting experiments on quantum technologies.

Develop a novel linear accumulation x-ray source to achieve an order of magnitude increase in performance over leading x-ray sources for critical dimension scattering. This project benefits researchers and manufacturers of semiconductor transistors.

Develop a measurement technology for in-line metrology, which has applications in materials purity, electrical properties, three-dimensional devices, and next generation manufacturing. This project will benefit the U.S. metrology and advanced packaging industries.

Develop cutting-edge technology for calibration of the instrument transfer function of extreme ultraviolet (EUV) lithographic tools. This project will advance EUV lithography technology for the U.S. semiconductor industry.

The CHIPS for America investment would support the construction of a new, modernized fab and foundry with over 40,000 square feet of cleanroom space, which would increase its InP PIC manufacturing to meet future capacity and capability demands.

The purpose of this grant is to establish an Entrepreneurial Fellowship Pilot program that will fund up to 10 early-stage companies ("Fellows") focused on innovations in semiconductor manufacturing technologies. The Pilot will establish a framework for other CHIPS-funded businesses to integrate innovative semiconductor ideas and technology into the semiconductor R&D ecosystem.

The award will support Applied Materials in developing and scaling a disruptive silicon-core substrate technology for next-generation advances in packaging and 3D heterogeneous integration.

The CHIPS for America award will provide Entegris up to $77 million in total direct funding under the CHIPS and Science Act to support the construction of its state-of-the-art manufacturing center in Colorado Springs. The center is being built in multiple phases: the first to support production of FOUPs — which are currently entirely produced abroad — and liquid filter membranes, and the second phase to support the production of advanced liquid filters and purifiers as well as fluid handling solutions. In addition to the manufacturing center, Entegris is also committed to further expanding their R&D capabilities in the United States by the end of the decade.