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Displaying 126 - 150 of 212

Workshop on Temperature Measurement of Semiconductor Wafers Using Thermocouples

January 1, 2001
Author(s)
Kenneth G. Kreider, D P. DeWitt, Benjamin K. Tsai, B Lojek
Temperature measurement is an important parameter in most semiconductor processes. These measurements are necessary in temperature ranges as low as below 0 C in some plasma etch processes, to near room temperature for soft bakes of resists, to 500 C for

Characterization of Lightpipe Radiation Thermometers for the NIST Test Bed

September 1, 2000
Author(s)
Benjamin K. Tsai, Christopher W. Meyer, Francis J. Lovas
For the past decade, lightpipe radiation theromoeters (LPRTs) have become the sensors of choice in rapid thermal processing (RTP) applications because of their non-intrusiveness and ease of use. In this paper, we discuss the importance of proper LPRT

Radiative Calibration of Heat Flux Sensors at NIST: Facilities and Techniques

March 1, 2000
Author(s)
A V. Murthy, Benjamin K. Tsai, Robert D. Saunders
An overview of the National Institute of Standards and Technology (NIST) high temperature blackbodies, both in operation and in development, suitable for heat flux sensor calibration is presented. Typical results of calibrations using the transfer

Comparative Calibration of Heat Flux Sensors in Two Blackbody Facilities

November 17, 1999
Author(s)
A V. Murthy, Benjamin K. Tsai, Robert D. Saunders
This paper presents the results of heat flux sensor calibrations in two blackbody facilities: the 25 mm variable temperature blackbody (VTBB) primary facility and a recently developed 51 mm aperture spherical blackbody (SPBB) facility. Three Schmidt