Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Search Publications by: Daniel Josell (Fed)

Search Title, Abstract, Conference, Citation, Keyword or Author
Displaying 26 - 50 of 276

Orientation and Magnetic Properties of FePt and CoPt Films Grown on MgO(110) Single-Crystal Substrate by Electron-Beam Coevaporation

October 12, 2021
Author(s)
M-H Yu, Hiroyuki Ohguchi, Antonio Zambano, Ichiro Takeuchi, J P. Liu, Daniel Josell, Leonid A. Bendersky
We have studied the orientation and magnetic properties of FePt and CoPt films deposited by electron-beam co-evaporation on MgO(110) single-crystal substrates at different substrate temperatures between 500 and 700 degrees C. We observed that the long

The Effect of Interfacial Free Energies on the Stability of Microlaminates

October 12, 2021
Author(s)
A C. Lewis, A B. Mann, D V. Heerden, Daniel Josell, Timothy P. Weihs
Laminated composites with polycrystalline layers typically break down at high temperatures through grain boundary grooving and the pinch-off of individual layers. Such materials, when exposed to high temperatures, develop grooves where grain boundaries

Additives for Superconformal Gold Feature Filling

May 11, 2021
Author(s)
Daniel Josell, Thomas P. Moffat
An overview of the effect of additives on Au electrodeposition from Na3Au(SO3)2 based electrolytes is presented with an emphasis on filling of fully metallized recessed surface features such as trenches and vias. The impact of heavy metals additives Tl+

Simulation of Copper Electrodeposition in Millimeter Size Through-Silicon Vias

December 16, 2020
Author(s)
Trevor Braun, Daniel Josell, Thomas P. Moffat
Computational predictions of copper deposition in millimeter size through-silicon vias (mm-TSV) are presented based on localized breakdown of a co-adsorbed polyether-chloride suppressor layer. The model builds upon previous work on localized Cu deposition

Pushing the Limits of Bottom-Up Gold Filling for X-Ray Grating Interferometry

September 30, 2020
Author(s)
Daniel Josell, Thomas P. Moffat, Z Shi, K Jefimovs, L Romano, J. Vila-Comamala
The application of superconformal Bi-catalyzed Au electrodeposition for void-free filling of recessed trenches in X-ray gratings used in phase contrast imaging is detailed. Filling of trenches with aspect ratio (height divided by its width) up to 55 is

Structural and magnetic properties of sputtered FePd thin films grown on MgO single-crystal substrates with oblique and normal substrate orientation

July 28, 2020
Author(s)
Xinjun Wang, Sergiy Krylyuk, Daniel Josell, Daniel Gopman, Jian-Ping Wang, Delin Zhang
Materials possessing perpendicular magnetic anisotropy derived from the intrinsic crystal structure, such as in L10 Fe-based alloys, have the potential to deliver superior scaling of magnetic memory elements compared to materials whose anisotropy is
Was this page helpful?