Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

Published

May 16, 2018

Author(s)

Trevor Braun, Daniel Josell, Thomas P. Moffat, Hyo Jong Lee, SH Kim

Abstract

This work examines the filling of Through Silicon Vias (TSV) by Ni deposition from a NiSO4 + NiCl2 + H3BO3 electrolyte containing a branched polyethyleneimine suppressor previously. Feature filling occurs through the coupling of transport limited suppressor adsorption and its consumption by potential dependent metal deposition. The former couples with surface topography to yield a sharp transition from passive to active deposition within the TSV. The transition is associated with significant incorporation of the suppressor, or its components, within the Ni deposit that results in grain refinement evident by electron back scatter diffraction (EBSD). In contrast, active deposition on the lower sidewalls exhibits columnar growth that tends towards a <110> texture along the growth direction. Potential programs that progressively shift the passive-active transition upward to optimize feature filling were examined. The evolution of feature filling and the deposit microstructure are compared to predictions of a three- dimensional model based on a suppressor-derived, s-shaped negative differential resistance (S- NDR) mechanism. The model uses adsorption and consumption kinetics obtained from voltammetric measurements of the critical potential associated with suppression breakdown. Good agreement between experiment and simulation is demonstrated.

Citation

Journal of the Electrochemical Society

Volume

7

Issue

165

Pub Type

Journals

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DOI Link

Keywords

electrodeposition, nickel, superfill, superconformal, via, TSV, through silicon via

Citation

Braun, T. , Josell, D. , Moffat, T. , Lee, H. and Kim, S. (2018), Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction, Journal of the Electrochemical Society, [online], https://doi.org/10.1149/2.0911807jes (Accessed October 28, 2025)