TY  - JOUR
AU  - Trevor Braun
AU  - Daniel Josell
AU  - Thomas Moffat
AU  - Hyo Lee
AU  - SH Kim
C2  - Journal of the Electrochemical Society
DA  - 2018-05-16 00:05:00
DO  - https://doi.org/10.1149/2.0911807jes
LA  - en
M1  - 7
PB  - Journal of the Electrochemical Society
PY  - 2018
TI  - Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction
ER  -