@article{809231,
  author = {Trevor Braun and Daniel Josell and Thomas Moffat and Hyo Lee and SH Kim},
  title = {Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction},
  year = {2018},
  number = {7},
  month = {2018-05-16 00:05:00},
  publisher = {Journal of the Electrochemical Society},
  doi = {https://doi.org/10.1149/2.0911807jes},
  language = {en},
}