Josell, D.
and Moffat, T.
(2018),
The Impact of Adsorbates on Metal Deposition Through The Curvature Enhanced Accelerator Coverage Mechanism… And Beyond, ECS Transactions
(Accessed April 19, 2024)
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The Impact of Adsorbates on Metal Deposition Through The Curvature Enhanced Accelerator Coverage Mechanism And Beyond
Published
Author(s)
,
Abstract
Superconformal electrodeposition utilizing additives that adsorb on the deposit surface and either enhance or suppress metal deposition enabled the implementation of damascene interconnects in microelectronics using copper superfill in the late 1990s. The underlying Curvature Enhanced Accelerator Coverage (CEAC) mechanism, which captures the interplay of adsorbate coverage and metal deposition through area change on nonplanar surfaces, was determined in 2001. CEAC-based models have successfully predicted superconformal deposition yielding void-free filling of fine features with all the coinage metals as well as the formation of optically smooth, soft deposits. Additives whose behavior changes as a function of adsorbate coverage present new challenges for understanding as well as opportunities for application.Citation
ECS Transactions
Volume
85
Issue
12
Pub Type
Journals
Keywords
superfill, interconnect, gold, superconformal, electrodeposition
Citation
Created May 13, 2018, Updated April 16, 2020