Skip to main content
U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

The Impact of Adsorbates on Metal Deposition Through The Curvature Enhanced Accelerator Coverage Mechanism… And Beyond

Published

Author(s)

Daniel Josell, Thomas P. Moffat

Abstract

Superconformal electrodeposition utilizing additives that adsorb on the deposit surface and either enhance or suppress metal deposition enabled the implementation of damascene interconnects in microelectronics using copper “superfill” in the late 1990’s. The underlying Curvature Enhanced Accelerator Coverage (CEAC) mechanism, which captures the interplay of adsorbate coverage and metal deposition through area change on nonplanar surfaces, was determined in 2001. CEAC-based models have successfully predicted superconformal deposition yielding void-free filling of fine features with all the coinage metals as well as the formation of optically smooth, soft deposits. Additives whose behavior changes as a function of adsorbate coverage present new challenges for understanding as well as opportunities for application.
Citation
ECS Transactions
Volume
85
Issue
12

Keywords

superfill, interconnect, gold, superconformal, electrodeposition

Citation

Josell, D. and Moffat, T. (2018), The Impact of Adsorbates on Metal Deposition Through The Curvature Enhanced Accelerator Coverage Mechanism… And Beyond, ECS Transactions (Accessed February 28, 2024)
Created May 13, 2018, Updated April 16, 2020