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Search Publications by: Thomas P. Moffat (Fed)

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Displaying 101 - 125 of 165

Compositional Control in Electrodeposited Ni (subscript x) Pt (subscript 1-x) Films

October 29, 2007
Author(s)
J Mallett, Erik B. Svedberg, John E. Bonevich, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
Electrochemical co-deposition of a series of fcc Ni(subscript x)PT(subscript 1-x) alloys is demonstrated. The alloy composition is a monotonic function of potential. The Pt-rich Ni(subscript x)PT(subscript 1-x) alloys are formed at potentials positive to

Electrodeposition of Ni in Sub-Micrometer Trenches

July 2, 2007
Author(s)
S D. Kim, John E. Bonevich, Daniel Josell, Thomas P. Moffat
A survey of the effect of cationic, anionic and non-ionic surfactants on the rate and morphological evolution of nickel electrodeposition from a Watts-type bath is presented. Particular attention is given to the prospect for void free filling of sub

Superfilling When Adsorbed Accelerators Are Mobile

February 6, 2007
Author(s)
Daniel Josell, Thomas P. Moffat, Daniel Wheeler
Bottom-up superfill during electrodeposition that is used for industrial processing of damascene copper interconnects has also been demonstrated during electrodeposition of silver and gold. The Curvature Enhanced Accelerator Coverage (CEAC) mechanism has

Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

October 10, 2006
Author(s)
Soo K. Kim, Daniel Josell, Thomas P. Moffat
Electroanalytical measurements and feature filling experiments have been conducted to study the effect of dodecyltrimethylammonium chloride (DTAC), a quaternary ammonium cationic surfactant, on Cu deposition in the presence of various combinations of

Underpotential Co-Deposition of Cu_subscript(1-x)Pt_subscript(x) Alloys

September 30, 2006
Author(s)
J Mallett, Ugo Bertocci, Erik B. Svedberg, John E. Bonevich, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
The electrodeposition of Cu_subscript (1-x)Pt_subscript(x) alloys by underpotential co-deposition of Cu with Pt is demonstrated using an H_subscript(2)SO_subscript(4)-CuSO_subscript(4-)PtCl_subscript(4)_superscript(2-) electrolyte. The composition and

Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

January 11, 2006
Author(s)
Thomas P. Moffat, Daniel Wheeler, Soo K. Kim, Daniel Josell
The impact of leveling additives acting through the traditional leveling mechanism of accumulation and consumption has been coupled with the Curvature Enhanced Accelerator Coverage (CEAC) mechanism previously used to explain bottom-up superfill of features

Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

December 2, 2005
Author(s)
Thomas P. Moffat, Marlon L. Walker, P J. Chen, John E. Bonevich, William F. Egelhoff Jr., Lee J. Richter, Daniel Josell, C A. Witt, T Aaltonen, M Ritala, M Leskela
Superfilling of sub-micrometer trenches by direct copper electrodeposition onto PVD and ALD Ru barriers is demonstrated. The Cu nucleation and growth mode is found to be sensitive to the oxidation state of the Ru surface as well as the copper deposition

Gold Superfill in Sub-Micrometer Trenches: Experiment and Prediction

November 16, 2005
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
Bottom-up deposition of gold in fine trenches, also called superfill, was recently demonstrated using a submonolayer coverage of preadsorbed, deposition-rate-accelerating lead followed by gold electrodeposition. The present study has used experiments on

Compositional Control in Electrodeposited Co x Pt -x Films.

August 1, 2005
Author(s)
J Mallett, Erik B. Svedberg, S Sayan, Alexander J. Shapiro, L Wielunski, T. E. Madey, P J. Chen, William F. Egelhoff Jr., Thomas P. Moffat
Electrochemical co-deposition of Co(subscript x)Pt(subscript 1-x) alloys is demonstrated at potentials positive to that required to deposit elemental cobalt (underpotential co-deposition). Co-deposition is atributed to the negative enthalpy of Co(subscript

Effect of Conformal Roughness on Ferromagnetic Resonance Linewidth in Thin Permalloy Films

May 1, 2005
Author(s)
Brian B. Maranville, J Mallett, Thomas P. Moffat, Robert McMichael, Andrew P. Chen, William F. Egelhoff Jr.
The ferromagnetic resonance line width is a result of both intrinsic damping and contributions from inhomogeneities, which in thin films can be dominated by the roughness. Microstructural measurements and magnetization dynamics are reported here for 50 nm

In Situ Ellipsometric Study of PEG/Cl - Coadsorption on Cu, Ag, and Au

May 1, 2005
Author(s)
Marlon L. Walker, Lee J. Richter, Thomas P. Moffat
Spectroscopic ellipsometry was used to examine the adsorption of polyethylene glycol (PEG) and Cl- on polycrystalline Cu, Ag and Au electrodes in sulfuric acid. In halide-free sulfuric acid, PEG adsorption on Cu and Ag is minimal at potentials positive of

Artifacts That Mimic Ballistic Magnetoresistance

February 1, 2005
Author(s)
William F. Egelhoff Jr., L Gan, H Ettedgui, Y Kadmon, Cedric J. Powell, P J. Chen, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles, Erik B. Svedberg
We have investigated the circumstances underlying recent reports of very large values of ballistic magntoresistance (BMR) in nanocontacts between magnetic wires. We find that the geometries used are subject to artifacts due to motion of the wires that