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Search Publications by: Thomas P. Moffat (Fed)

Displaying 101 - 125 of 333

The Suppression Breakdown induced S-NDR Mechanism for Defect-Free Filling of High Aspect Ratio Features

September 23, 2016

Author(s)

Daniel Josell, Thomas P. Moffat

Superconformal electrodeposition in Through Silicon Vias for multiple metal systems is summarized and shown to be explained by models based on suppressor-induced, S-shaped negative differential resistance (S-NDR). Just published results for superconformal

Stabilizing Electrodeposited Nanoparticle Electrocatalysts on Si MIS Photocathodes

September 9, 2016

Author(s)

Thomas P. Moffat

Electrodepositing low loadings of metallic nanoparticle catalysts onto the surface of semiconducting photoelectrodes is a highly attractive approach for decreasing catalyst costs and minimizing optical losses. However, securely anchoring nanoparticles to

Self-terminated Electrodeposition of Ni, Co and Fe Ultrathin Films

July 28, 2016

Author(s)

Thomas P. Moffat

Self-terminated iron group metal electrodeposition occurs at potentials negative of the onset of water reduction due to formation of a monolayer thick hydroxide layer. Quenching of metal deposition is accompanied by an increase in dissipative energy loss

Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias

April 30, 2016

Author(s)

Daniel Josell, Thomas P. Moffat

This work demonstrates controlled bottom-up nickel filling of Through Silicon Vias based on the coupling of suppression breakdown and surface topography. Deposition was performed in a NiSO4 + NiCl2 + H3BO3 electrolyte with a branched polyethyleneimine

Self-terminated Electrodeposition of Iridium Electrocatalysts

September 16, 2015

Author(s)

Thomas P. Moffat

A simple electrochemical process for submonolayer deposition of ultrathin catalytic iridum (Ir) films is demonstrated. The process enables effective utilization of one of natures rarest elements while different substrates facilitate the exploration of

Morphological transitions during Au electrodeposition: from porous to compact films and nanowires

August 28, 2015

Author(s)

Daniel Josell, Igor Levin, Thomas P. Moffat

Gold electrodeposition was studied in a sulfite electrolyte to which micromolar concentrations of Tl2SO4 were added. Hysteresis and a regime of negative differential resistance (NDR) evident in electroanalytical measurements are correlated with deposit

Methods of Photoelectrode Characterization with High Spatial and Temporal Resolution

August 17, 2015

Author(s)

Thomas P. Moffat

Materials and photoelectrode architectures that are highly efficient, extremely stable, and made from low cost materials are required for commercially viable photoelectrochemical (PEC) water-splitting technology. A key challenge is the heterogeneous nature

Formic Acid oxidation on platinum- a simple mechanistic study

July 15, 2015

Author(s)

Kathleen A. Schwarz, Ravishankar Sundararaman, Thomas P. Moffat, Thomas C. Allison

The oxidation of organic acids on noble metal sur-faces is of importance for industrial processes and of academic interest, but the basic reaction mechanisms continue to be a matter of debate. Historically, mechanisms involving the formic acid molecule

Ultrathin platinum films for methanol and formic acid oxidation: activity as a function of film thickness and coverage

February 18, 2015

Author(s)

Thomas P. Moffat

Self-terminating electrodeposition was used to grow ultrathin Pt overlayers on 111 textured Au thin films. The Pt thickness was digitally controlled by pulsed potential deposition enabling the influence of overlayer thickness on electrocataytic reactions

Bottom-up Electrodeposition of Zinc in Through Silicon Vias Using Breakdown of Additive-Derived Suppression

January 12, 2015

Author(s)

Daniel Josell, Thomas P. Moffat

This paper presents superconformal feature filling during zinc electrodeposition in a sulfate electrolyte. Localized bottom-up filling of Through Silicon Vias (TSVs) with no deposition on the sidewalls or the field around them is presented in electrolytes

Superconformal Cu Electrodeposition from Cu(II)-EDTA Complexed Alkaline Electrolyte

July 26, 2014

Author(s)

Daniel Josell, Thomas P. Moffat

This paper details superconformal filling of submicrometer trenches with bright, dense copper from alkaline cupric ethylenediaminetetraacetic acid (EDTA) electrolyte of pH 12. Enhanced deposition from the bottom corners of the trenches and overfill bumps

Self-terminating electrodeposition of ultrathin Pt films on Ni: An active, low-cost electrode for H2 production

June 14, 2014

Author(s)

Yihua Y. Liu, Carlos M. Hangarter, Thomas P. Moffat

Self-terminating electrodeposition was developed for depositing ultrathin Pt overlayers on segmented electrodeposited Ni films supported on Au. The partitioned substrates provided an internal reference, namely, Pt on Au versus Pt on Ni, for every growth

Superconformal Copper Electrodeposition in Complexed Alkaline Electrolyte

April 3, 2014

Author(s)

Daniel Josell, Thomas P. Moffat

This paper examines superconformal filling of trenches during copper electrodeposition from alkaline cupric tartrate electrolyte. Extreme bottom-up filling of submicrometer damascene trenches with minimal deposition on the sidewalls and the field around