Publications

Displaying 76 - 100 of 333

SEIRAS Study of Chloride Mediated Polyether Adsorption on Cu

August 31, 2018

Author(s)

Thomas P. Moffat, Daniel Josell, Lee J. Richter

Surface enhanced infrared absorption spectroscopy (SEIRAS) was used to examine the co- adsorption of a selection of polyethers with Cl- under conditions relevant to superconformal Cu electrodeposition in CuSO4-H2SO4 electrolytes. In 0.1 mol/L H2SO4 a

Bottom-up Filling of Damascene Trenches with Gold in a Sulfite Electrolyte

August 19, 2018

Author(s)

Daniel Josell, Thomas P. Moffat

Superconformal Au deposition is demonstrated in a Na3Au(SO3)2 + Na2SO3 electrolyte including Bi3+. Micromolar additions of the Bi3+ to the electrolyte catalyze the reduction of Au(SO3)23- based on hysteretic voltammetry and rising chronoamperometric

Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

May 16, 2018

Author(s)

Trevor Braun, Daniel Josell, Thomas P. Moffat, Hyo Jong Lee, SH Kim

This work examines the filling of Through Silicon Vias (TSV) by Ni deposition from a NiSO4 + NiCl2 + H3BO3 electrolyte containing a branched polyethyleneimine suppressor previously. Feature filling occurs through the coupling of transport limited

The Impact of Adsorbates on Metal Deposition Through The Curvature Enhanced Accelerator Coverage Mechanism And Beyond

May 13, 2018

Author(s)

Daniel Josell, Thomas P. Moffat

Superconformal electrodeposition utilizing additives that adsorb on the deposit surface and either enhance or suppress metal deposition enabled the implementation of damascene interconnects in microelectronics using copper superfill in the late 1990s

Performance and failure modes of Si anodes patterned with thin-film Ni catalyst islands for water oxidation

March 6, 2018

Author(s)

Ke Sun, Nicole L. Ritzert, Jimmy John, Haiyan Tan, William G. Hale, Jingjing Jiang, Kimberly M. Papadantonakis, Thomas P. Moffat, Bruce S. Brunschwig, Nathan S. Lewis

Silicon photoanodes patterned with Ni thin film catalyst islands exhibited stable oxygen evolution for over 240 h of continuous operation in 1.0 mol L-1 KOH(aq) under simulated sunlight conditions. Buried-junction np+-Si(111) photoanodes with an 18.0%

Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown

January 5, 2018

Author(s)

Daniel Josell, Thomas P. Moffat

The evolution of superconformal Cu electrodeposition in high aspect ratio through silicon vias (TSVs) is examined as a function of polymer suppressor concentration, applied potential and hydrodynamics. Electroanalytical measurements in a CuSO4-H2SO4-Cl

Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias

April 14, 2017

Author(s)

Daniel Josell, Thomas P. Moffat

This work presents superconformal, bottom-up Au filling of high aspect ratio Through Silicon Vias (TSVs) along with a predictive framework based on the coupling of suppression breakdown and surface topography. The work extends a previous study of

Deconvoluting the Influences of 3D Structure on the Performance of Photoelectrodes for Solar-Driven Water Splitting

February 7, 2017

Author(s)

Daniel V. Esposito, Youngmin Lee, Heayoung Yoon, Paul M. Haney, Natalie Labrador, Thomas P. Moffat, A. A. Talin, Veronika A. Szalai

Abstract Three-dimensionally (3D) structured photoelectrodes offer a number of potential benefits for solar fuels production compared to conventional planar photoelectrodes, including decreased optical losses, higher surface area for catalysis, more facile

Ultramicroelectrode Studies of Self-Terminated Nickel Electrodeposition and Nickel Hydroxide Formation upon Water Reduction

November 14, 2016

Author(s)

Nicole Ritzert, Thomas P. Moffat

The interaction between electrodeposition of Ni and electrolyte breakdown, namely the hydrogen evolution reaction (HER) via H3O+ and H2O reduction, was investigated under well-defined mass transport conditions using ultramicroelectrodes (UMEs) coupled

Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias

November 11, 2016

Author(s)

Daniel Josell, Thomas P. Moffat, Manoj R. Silva

This work demonstrates and models controlled bottom-up Co filling of Through Silicon Vias (TSVs) based on the coupling of suppression breakdown and surface topography. Deposition was performed in a CoSO4 + CoCl2 + H3BO3 electrolyte with a branched

Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias

September 23, 2016

Author(s)

Daniel Josell, Manoj R. Silva, Thomas P. Moffat

This work demonstrates void-free cobalt filling of 56 um tall, annual Through Silicon Vias (TSVs) using a mechanism that couples suppression breakdown and surface topography to achieve controlled bottom-up deposition. The chemistry, a Watts electrolyte

Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias

September 23, 2016

Author(s)

Daniel Josell, Thomas P. Moffat

Abstract: This work demonstrates void-free nickel filling of 56 μm tall, annular Through Silicon Vias (TSVs) using a mechanism that couples suppression breakdown and surface topography to achieve controlled superconformal, void-free deposition. The

The Suppression Breakdown induced S-NDR Mechanism for Defect-Free Filling of High Aspect Ratio Features

September 23, 2016

Author(s)

Daniel Josell, Thomas P. Moffat

Superconformal electrodeposition in Through Silicon Vias for multiple metal systems is summarized and shown to be explained by models based on suppressor-induced, S-shaped negative differential resistance (S-NDR). Just published results for superconformal

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