Moffat, T.
and Josell, D.
(2010),
Superconformal Electrodeposition for 3-D Interconnects, Israel Journal of Chemistry
(Accessed May 7, 2025)
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Superconformal Electrodeposition for 3-D Interconnects
Published
Author(s)
,
Abstract
Electrodeposition is a key fabrication process used in the state-of-the-art multilevel Cu metallization of microelectronic interconnects from transistor to circuit board length scale. Recent electrochemical surface science and feature filling studies have provided mechanistic insight into the role of additives in superconformal film growth responsible for void-free filling of recessed surface features. These studies have shown that a physical model based on mass conservation of accelerating surfactant species during area change very effectively describes feature filling of Cu, Ag and Au from different electrolytes. This paper presents a selective and cursory review of some relevant developments underway in our laboratory.Citation
Israel Journal of Chemistry
Pub Type
Journals
Keywords
Damascene Processing, Electrodeposition, Superconformal Film Growth, Superfilling
Citation
Issues
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Created September 7, 2010, Updated February 26, 2020