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The Influence of Additives on the Room-Temperature Recrystallization of Electrodeposited Copper

Published

Author(s)

Gery R. Stafford, Mark D. Vaudin, Thomas P. Moffat, N G. Armstrong, David R. Kelley

Abstract

The recrystallization behavior of copper, electrodeposited from a copper sulfate-sulfuric acid plating bath into which various combinations of NaCl, sodium 3-mercapto-1propanesulfonate (MPSA), the polyethylene glycol (PEG) has been added, was examined by x-ray diffraction and 4-point resistivty. Significant room temperature recrystallization and resistance decrease are observed only when MPSA and PEG are present in the electrolyte together, particularly in the presence of chloride. The rate of recrystallization is linked to the grain refinement brought about by different bath chemistries. The significance of halide adsorption on copper additive plating is discussed.
Conference Dates
November 3, 1999
Conference Location
Undefined
Conference Title
Advanced Metallization Conference

Keywords

additives, adsorption, copper, metallization, recrystallization, resistivity

Citation

Stafford, G. , Vaudin, M. , Moffat, T. , Armstrong, N. and Kelley, D. (2008), The Influence of Additives on the Room-Temperature Recrystallization of Electrodeposited Copper, Advanced Metallization Conference, Undefined (Accessed April 20, 2024)
Created October 16, 2008