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Search Publications by: Francis J. Lovas (Assoc)

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Displaying 76 - 100 of 160

Characterization of Lightpipe Radiation Thermometers for the NIST Test Bed

September 1, 2000
Author(s)
Benjamin K. Tsai, Christopher W. Meyer, Francis J. Lovas
For the past decade, lightpipe radiation theromoeters (LPRTs) have become the sensors of choice in rapid thermal processing (RTP) applications because of their non-intrusiveness and ease of use. In this paper, we discuss the importance of proper LPRT

Deployment Test of the NIST EOS Thermal-Infrared Transfer Radiometer

November 1, 1999
Author(s)
Joseph P. Rice, S C. Bender, W H. Atkins, Francis J. Lovas
The National Institute of Standards and Technology (NIST) Thermal-infrared Transfer Radiometer (TXR), developed for the National Aeronautics and Space Administration (NASA) Earth Observing System (EOS), was deployed at the remote sensing radiometric

The Rotational Spectrum of Ar-SiH 4 and Ar--SiD 4

January 1, 1999
Author(s)
Y Kawashima, R D. Suenram, Gerald T. Fraser, Francis J. Lovas, Katsuya Hirota
Microwave spectra of Ar-- 28SiH 4, Ar-- 29SiH 4, Ar-- 30SiH 4, and Ar-- 28SiD 4 have been recorded using a pulsed-molecular-beam Fourier-transform microwave spectrometer. The K = 0 and K = 1 components of the J=3

RTP Calibration Wafer Using Thin-Film Thermocouples

April 1, 1998
Author(s)
Kenneth G. Kreider, D P. DeWitt, Benjamin K. Tsai, Francis J. Lovas, David W. Allen
Rapid thermal processing (RTP) is a key technology for the cluster tool, single wafer manufacturing approach that is used to produce integrated circuits at lower cost with reduced line widths and thermal budgets. However, various problems associated with