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Displaying 426 - 450 of 1410

On the Internet Connectivity in Africa

November 18, 2015
Author(s)
Assane Gueye, Peter Mell, Desire Banse, Faical Y. Congo
This study measures and documents growth of Internet connectivity in Africa from 2010 to 2014 with a focus on inter-country relationships. We evaluate both intra-continent connectivity as well as connectivity to other continents. An initial analysis

Software-defined Radio Based Measurement Platform for Wireless Networks

October 15, 2015
Author(s)
I-Chun Chao, Kang B. Lee, Rick Candell, Frederick M. Proctor, Chien-Chung Shen
There has been a dramatic push to adopting wireless networking technologies and protocols (such as 802.11, ZigBee, WirelessHART, Bluetooth, ISA100.11a, etc.) into time-critical networks. End-to-end latency is critical to many distributed applications and

Interference and Coexistence of Wireless Systems in Critical Infrastructure

July 7, 2015
Author(s)
Galen H. Koepke, William F. Young, John M. Ladbury, Jason B. Coder
We examine interference and coexistence testing issues, test methods, and the need to update and develop new test methodologies related to the use of wireless devices in critical infrastructure systems. A case study on interference is presented along with

Designing a Cyber-Physical Cloud Computing Architecture

June 2, 2015
Author(s)
Eric D. Simmon, Sulayman Sowe, Koji Zettsu
In this era of inter-connectivity where almost everybody, everything, and anything are networked, Cyber-Physical Systems (CPS) also known as the Internet of Things (IoT) have emerged as vital systems that use information systems to observe and modify the

Evaluation of Uncertainty in Temporal Waveforms of Microwave Transistors

June 1, 2015
Author(s)
Gustavo Avolio, Antonio Raffo, Jeffrey Jargon, Dominique Schreurs, Dylan Williams
This work focuses on the accuracy of nonlinear de-embedding applied to microwave transistor time-domain waveforms. The waveforms are acquired with a mixer-based Large-Signal Network Analyzer (LSNA) and are corrected at the transistor's reference planes by

PASSING THE BATON: Message FROM THE INCOMING EDITOR-IN-CHIEF

June 1, 2015
Author(s)
Hamid Gharavi
This incoming Editor In Chief's (EIC) message is expected to appear in the next issue of the IEEE wireless communications. The editorial team will be under the leadership of the new EIC for a period of three years.

Experimentally, How Does Cu TSV Diameter Influence its Stress State?

May 27, 2015
Author(s)
Chukwudi A. Okoro, Lyle E. Levine, Yaw S. Obeng, Ruqing Xu
In this work, an experimental study of the influence of Cu through-silicon via (TSV) diameter on stress build up was performed using synchrotron-based X-ray microdiffraction technique. Three Cu TSV diameters were studied; 3 µm, 5 µm and 8 µm, all of which
Displaying 426 - 450 of 1410
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