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William T. Estler, Steven D. Phillips, Bruce R. Borchardt, Ted Hopp, Christoph J. Witzgall, M Levenson, et al
We present the analysis of a simple mechanical model of a common type of kinematic seat touch trigger probe widely used on modem coordinate measuring machines (CMMs). The model provides a quantitative description of the pre-travel variation or probe lobing
The use of special machine tools with single-crystal diamond-cutting tools to produce metal optics is called diamond turning. The manufacture of optical surfaces by diamond turning is relatively new compared to the traditional optical-polishing methods. In
This study investigated the performance and wear behavior of different cubic boron nitride (CBN) tools in finish turning of hardened 52100 steels. Tool performance was evaluated based on surface finish and flank wear land width. Wear mechanisms of CBN
J Schneir, John S. Villarrubia, T Mcwaid, V W. Tsai, Ronald G. Dixson
Atomic force microscopes are being used increasingly for process metrology. As a case study, the measurement by atomic force microscope of a soda lime glass optical disk patterned using optical lithography and reactive plasma etching is examined. The
S Jahanmir, T W. Hwang, Eric P. Whitenton, S Job, Christopher J. Evans
Using an instrumented surface grinder, the two components of grinding forces (normal and tangential) were measured for different types of silicon nitride ceramics. The influences of grinding parameters, such as down feed and table speed, and grinding
L Linholm, Robert Allen, Michael W. Cresswell, Rathindra Ghoshtagore, S Mayo, H Schafft, John A. Kramar
The results from high-quality electrical and physical measurements on the same cross-bridge resistor test structure with approximately vertical sidewalls have shown differences in linewidth as great as 90 nm for selected conductive films. These differences
An improved method for temporarily converting long gage blocks into line scales is described. The new process employs fused silica rather than previously used steel conversion gage blocks. Conversion blocks are pairs of small (13 mm) gage blocks with
The subject of coordinate measuring machine (CMM) evaluation is a broad an multifaceted one. The theme of this chapter is the evaluation of CMM measurement uncertainty which is central to the concept of traceability. This chapter elucidates the sources of
Ralph C. Veale, Edgar G. Erber, Bruce R. Borchardt
The reference datum for a screw thread is the pitch diameter cylinder. Although a defined method within the United states for pitch diameter measurement exists, it does not follow worldwide procedures, and the complexity and uncertainties associated with
Progress since the last Industrial Applications of Scanned Probe Microscopy workshop in the estimation of tip geometries for scanned probe microscopes is discussed. A new method which does not require calibration of the tip characterizers has been
An attitude has developed that the results of any SEM measurement arc absolutely true. If this were the case, there would be no need for standards and no metrological problems would exist in making submicrometer measurements. Multiple, basic errors
The scattering of a plane monochromatic wave by an infinite dielectric wedge is discussed for arbitrary direction of incidence and polarization. Two sets of coupled integral equations for an unknown surface function are derived. The behavior of the fields
Direct patterning of a semiconductor surface to produce an ultrathin oxide mask has proven to be a promising approach for integrating lithographic methods based on scanned probe microscopy (SPM) into existing electronics device processing. The resulting
The Second Workshop on Industrial Applications of Scanned Probe Microscopy (IASPM) was held at the National Institute of Standards and Technology (NIST) Gaithersburg on May 2-3, 1995. The meeting, co-sponsored by NIST, SEMATECH, the American Society for
This user's manual is a guide to the FORTRAN code MONSEL-I which is a Monte Carlo simulation of the transmitted and backscattered electron signals in a scanning electron microscope (SEM) associated with a line specimen with a trapezoidal cross section. The
Different working standards and check standards are used in the NIST surface and microform measurement laboratory for calibrating instruments, establishing measurement traceability and control measurement uncertainty. The basic requirements for these
Michael T. Postek, Andras Vladar, G Banke, T Reilly
An accurate electron beam model is primary to the understanding of the SEM image. Several independently developed Monte Carlo models have been introduced for this purpose and a modeling round-robin has just been conducted to compare the results of these
The measurement of critical dimensions of features on integrated circuits and photomasks is modeled as the comparison of the images of the test object and of a standard object in a measuring device. A length measuring instrument is then a comparator. The
Photomask linewidth measurements are needed for vendor/buyer communication, for developing specifications and ensuring that products meet specifications, and sometimes for legal compliance. Linewidths are also measured for process monitoring for either
There are a number of parameters used to characterize a measurement result for the purposes of specifying its value for the intended purpose. Precision (variability) and accuracy (correctness) are two of the more often used parameters and, like many other
Tunneling spectroscopy of sulfur- and oxygen-terminated n- and p-type GaAs (110) surfaces is reported for air and ultrahigh-vacuum conditions. Simulations of the complete I-V characteristics with explicit inclusion of surface states within the planar
It is recognized that profiling techniques have been widely used in industry and academic research for manufacturing control and functional control of surface roughness, in some cases, however, the profiling techniques and two-dimensional (2D) parameters
This is the last part in a series of reports describing a comprehensive study of parameters to characterize three-dimensional surface topography. In conjunction with other parts of the report, this paper deals with parameters used to characterize spatial