Skip to main content

NOTICE: Due to a lapse in annual appropriations, most of this website is not being updated. Learn more.

Form submissions will still be accepted but will not receive responses at this time. Sections of this site for programs using non-appropriated funds (such as NVLAP) or those that are excepted from the shutdown (such as CHIPS and NVD) will continue to be updated.

U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Accuracy in Integrated Circuit Dimensional Measurements

Published

Author(s)

James E. Potzick

Abstract

The measurement of critical dimensions of features on integrated circuits and photomasks is modeled as the comparison of the images of the test object and of a standard object in a measuring device. A length measuring instrument is then a comparator. The calibration of the standard and the conditions necessary for a valid comparison are discussed. The principles discussed here apply to many other types of measurement as well.
Citation
Chapter 3 in: Handbook of Critical Dimension Metrology and Process Control
Publisher Info
SPIE-International Society for Optical Engineering,

Keywords

accuracy, measurement, measurement uncertainty, modeling, traceability

Citation

Potzick, J. (1994), Accuracy in Integrated Circuit Dimensional Measurements, SPIE-International Society for Optical Engineering, (Accessed October 14, 2025)

Issues

If you have any questions about this publication or are having problems accessing it, please contact [email protected].

Created December 1, 1994, Updated February 19, 2017
Was this page helpful?