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Develop advanced dimensional metrology tools for semiconductor fabrication equipment to minimize the gap in the physical-digital divide and amplifying the accuracy of digital twins. This project will benefit the U.S. microelectronics supply chain.
Develop hybrid atomic force microscopy instrument that will automatically generate maps of the thermal resistance, thermal boundary interface resistance, and temperature profiles of microprocessors and wide bandgap semiconductor materials and devices. This project will benefit devices with thermal management challenges and materials development needs on length scales smaller than 100 nanometers.
Develop a rapid and accurate high-resolution ion microscopy technology for materials characterization particularly focused on challenges for the semiconductor industry. This project will benefit the U.S. semiconductor industry and researchers.
Develop a reference implementation of the Commercial Trust™ Protocol (CTP) to manage verifiable credentials (VCs), metrology, and intellectual property, enhancing hardware security, and provenance tracking of microelectronic components across supply chains. This project will benefit the U.S. microelectronics supply chain industry.
Develop cutting-edge technology for calibration of the instrument transfer function of extreme ultraviolet (EUV) lithographic tools. This project will advance EUV lithography technology for the U.S. semiconductor industry.
Develop a measurement technology for in-line metrology, which has applications in materials purity, electrical properties, three-dimensional devices, and next generation manufacturing. This project will benefit the U.S. metrology and advanced packaging industries.
Develop AI-powered software to automate chip design optimization for manufacturability through accelerated lithography simulation. This project will benefit U.S. researchers and industry involve in semiconductor design and manufacturing.
Develop a new measurement tool to analyze airborne contaminants and toxic gases inside and outside the fab that lead to semiconductor processing defects and safety infringements. This project will benefits U.S semiconductor fabrication facilities.
Develop a novel linear accumulation x-ray source to achieve an order of magnitude increase in performance over leading x-ray sources for critical dimension scattering. This project benefits researchers and manufacturers of semiconductor transistors.
Develop a transmission electron microscopy in-situ specimen holder that enables real-time imaging of nano-scale electronic devices. The project will benefit manufacturers and researchers of next-generation high-voltage power converters used in a wide variety of industries.