CHIPS Funding Sites

The CHIPS for America award will provide Intel Arizona up to $3.94 billion in total direct funding under the CHIPS and Science Act to support the construction of two new leading-edge logic fabs and modernization of one existing fab, significantly increasing leading-edge logic capacity, including high volume domestic production of Intel 18A – the company’s most advanced chip design that enables higher performing, leading-edge chips through RibbonFET gate-all-around transistors and PowerVia backside power delivery.

The CHIPS for America award will provide Intel New Mexico up to $500 million in total direct funding under the CHIPS and Science Act to support the modernization of two existing fabs into an advanced packaging facility to close an important gap in the domestic semiconductor supply chain.

The CHIPS for America award will provide BAE Systems up to $35.5 million in total direct funding under the CHIPS and Science Act to support a modernization project that will replace aging tools and quadruple the production of chips necessary for critical defense programs, including the $1.7 trillion F-35 fighter jet program.

The CHIPS for America award will provide Rocket Lab up to $23.9 million in total direct funding under the CHIPS and Science Act to support the creation of a more robust and resilient supply of space-grade solar cells that power spacecrafts and satellites. The modernization and expansion project would increase Rocket Lab’s compound semiconductor production by 50% within the next three years – helping to meet the growing national security and commercial demand for these solar cells in the United States.

The CHIPS for America award will provide the company with up to $6.6 billion in total direct funding under the CHIPS and Science Act to support the company’s planned investment of more than $65 billion in three greenfield leading-edge fabs in Phoenix, Arizona.

The proposed investment in Powerex would support the modernization and expansion of the company’s back-end production facility in Youngwood, Pennsylvania.

UT Austin's proposed project, "GENIE-RFIC: Generative ENgine for Intelligent and Expedited RFIC Design,” targets both Silicon (Si) Complementary Metal Oxide Semiconductor (CMOS) RFICs and Gallium Nitride (GaN) Monolithic Microwave Integrated Circuits (MMICs). The AI-driven tools will perform rapid "inverse" designs based on target specifications, optimizing circuit topologies and parameters. The proposal features a strong team from academia and industry, a clear commercialization plan with Electronic Design Automation (EDA)/foundry/RFIC partnerships, and strategies for risk mitigation. The project aims to enhance RFIC design productivity and produce optimized, non-intuitive solutions.

Keysight Technologies' proposed project, "AI for Accelerating RFIC Design Efficiency, Innovation, and Optimization for U.S. Competitiveness," seeks to automate complex design tasks using AI-driven tools. The Keysight team, drawing on expertise from major commercial and defense companies, universities, and innovative startups, aims to make the AI-enhanced workflow accessible to designers of all experience levels. By driving automation, optimization, and generation of advanced and unique RFIC designs, the project will improve the productivity and competitiveness of participating members in the U.S. semiconductor industry and, itself, become a key framework for innovation.

Princeton University's proposed project, "IMAGINE: Inverse Methods and Generative AI for Algorithmic and Non-intuitive Design Explorations in RFICs," focuses on rapid, automated design and optimization from specifications to layout. The project aims to reduce design time and cost while discovering novel design spaces that enhance RFIC performance. The team, comprising top researchers from academia and industry, employs deep learning and generative AI to create predictive models and designs for complex RFICs.

The proposed funding would support the construction of a new silicon carbide wafer manufacturing facility in Siler City, North Carolina, helping to secure a reliable domestic supply of the semiconductors that will underpin the future energy economy and AI boom.

The proposed CHIPS investment is expected to catalyze its planned expansion of its device manufacturing facility which would contribute to the growth of the facility as the world’s first fully automated 200mm silicon carbide power device fab and increase its production capacity.

The CHIPS for America award will provide the company with up to $123 million in total direct funding under the CHIPS and Science Act to expand and modernize the company’s manufacturing facility in Bloomington, Minnesota, doubling its U.S. production capacity of sensor and power chips within two years.

The purpose of this grant is to establish an Entrepreneurial Fellowship Pilot program that will fund up to 10 early-stage companies ("Fellows") focused on innovations in semiconductor manufacturing technologies. The Pilot will establish a framework for other CHIPS-funded businesses to integrate innovative semiconductor ideas and technology into the semiconductor R&D ecosystem.

The proposed CHIPS investment would support the construction of RVM’s pure play microelectromechanical systems (MEMS) and sensor foundry facility in Palm Bay, Florida, and is estimated to nearly triple RVM’s manufacturing capacity. MEMS are microscale devices that integrate electrical and mechanical components; their integration with semiconductor components across a wide range of applications enables technology advancements and improved performance.

The proposed CHIPS for America investment will expand a fabrication facility in Gresham, Oregon, which would enable Microchip to significantly increase its U.S. production of microcontroller units and other specialty semiconductors built on mature-nodes critical to America’s automotive, commercial, industrial, defense, and aerospace industries.