CHIPS Program Office Awards

CHIPS for America’s proposed investment in Oregon would support the expansion of front-end mature node semiconductor manufacturing for devices used in a wide variety of applications, including but not limited to automotive, industrial, and defense applications.

CHIPS for America’s proposed investment in Washington would support the expansion of front-end mature node semiconductor manufacturing for devices used in a wide variety of applications, including but not limited to automotive, industrial, and defense applications.

The proposed investment in ADI would support the expansion and modernization of two advanced research & development (R&D) and Radio Frequency (RF) Microwave (MW) systems manufacturing facilities in Chelmsford, Massachusetts.

The proposed CHIPS investment would also support the expansion of the facility’s SiC epitaxial wafer manufacturing capacity, back-end of line processing, electronic performance, and reliability testing capabilities. SiC substrates are an important bandgap material with end uses in energy and military applications.

The proposed CHIPS funding would support the manufacturing of ultra-high purity (UHP) isopropyl alcohol (IPA) used in advanced logic and memory chip production.

The proposed CHIPS investment would increase the production of 100mm Gallium Nitride (GaN) and Gallium Arsenide (GaAs) semiconductor fabrication and introduce the production of 150mm GaN.

The proposed CHIPS funding would support the expansion and modernization of MACOM’s existing facility which would increase the production of 100mm Gallium Nitride (GaN) and Gallium Arsenide (GaAs) semiconductor fabrication and introduce the production of 150mm GaN.

The CHIPS for America award will provide HP up to $53 million in total direct funding under the CHIPS and Science Act to support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from research and development (“R&D”) activities to commercial manufacturing operations.

The CHIPS for America award will provide Hemlock Semiconductor up to $325 million in total direct funding under the CHIPS and Science Act to support the construction of a new manufacturing facility on HSC’s existing campus in Hemlock, Michigan, dedicated to the production and purification of hyper-pure semiconductor-grade polysilicon.

The CHIPS for America award will provide Amkor Technology Peoria, Arizona up to $407 million in total direct funding under the CHIPS and Science Act to support the construction of a new advanced packaging and testing facility ensuring a reliable domestic advanced packaging ecosystem, supporting leading-edge clusters, and helping meet the growing demand for AI chips.

The CHIPS for America award will provide Texas Instruments Sherman, Texas up to $900 million in total direct funding under the CHIPS and Science Act to support the construction of two new, large-scale 300-mm fabrication facilities that are expected to produce 65nm – 130nm analog and embedded processing semiconductors, with anticipated production capacity of tens of millions chips every day. The Sherman site is one of the only greenfield production sites for current-generation and mature-node chips on 300-mm wafers in the U.S.

The CHIPS for America award will provide Texas Instruments Lehi, Utah up to $700 million in total direct funding under the CHIPS and Science Act to support the construction of a new, large-scale 300-mm fabrication facility to produce 28nm – 65nm analog and embedded processing semiconductors, which is anticipated to produce tens of millions of chips every day. This project represents the largest economic investment in Utah’s history.

The CHIPS for America award will provide Samsung Austin, Texas up to $4.745 billion in total direct funding under the CHIPS and Science Act to support the construction of a comprehensive advanced manufacturing ecosystem that includes both high volume leading-edge logic manufacturing and dedicated space for R&D and will transform the small municipality of Taylor into an expansive hub of leading-edge semiconductor manufacturing. This ecosystem would include two leading-edge logic foundry fabs focused on mass production of 2nm process technologies and an R&D lab dedicated to research and development of manufacturing process nodes at least several generations ahead of the current one in production.

The CHIPS for America award will provide Samsung Austin, Texas up to $4.745 billion in total direct funding under the CHIPS and Science Act to support the expansion of a facility that has been an economic engine for Central Texas for nearly 30 years. This investment would expand the existing facilities to support the production of leading fully depleted silicon-on-insulator (FD-SOI) process technologies for critical U.S. industries, including aerospace, defense, and automotive. This investment also includes commitments to collaborate with the U.S. Department of Defense.

The CHIPS for America investment in SK Hynix of up to $458 million in direct funding under the CHIPS and Science Act will support the establishing of a high-bandwidth memory (HBM) advanced packaging fabrication and research and development (R&D) facility.