CHIPS Program Office Awards

The CHIPS for America award will provide HP up to $53 million in total direct funding under the CHIPS and Science Act to support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from research and development (“R&D”) activities to commercial manufacturing operations.

The CHIPS for America award will provide Hemlock Semiconductor up to $325 million in total direct funding under the CHIPS and Science Act to support the construction of a new manufacturing facility on HSC’s existing campus in Hemlock, Michigan, dedicated to the production and purification of hyper-pure semiconductor-grade polysilicon.

The CHIPS for America award will provide Texas Instruments Sherman, Texas up to $900 million in total direct funding under the CHIPS and Science Act to support the construction of two new, large-scale 300-mm fabrication facilities that are expected to produce 65nm – 130nm analog and embedded processing semiconductors, with anticipated production capacity of tens of millions chips every day. The Sherman site is one of the only greenfield production sites for current-generation and mature-node chips on 300-mm wafers in the U.S.

The CHIPS for America award will provide Texas Instruments Lehi, Utah up to $700 million in total direct funding under the CHIPS and Science Act to support the construction of a new, large-scale 300-mm fabrication facility to produce 28nm – 65nm analog and embedded processing semiconductors, which is anticipated to produce tens of millions of chips every day. This project represents the largest economic investment in Utah’s history.

The CHIPS for America award will provide Amkor Technology Peoria, Arizona up to $407 million in total direct funding under the CHIPS and Science Act to support the construction of a new advanced packaging and testing facility ensuring a reliable domestic advanced packaging ecosystem, supporting leading-edge clusters, and helping meet the growing demand for AI chips.

The CHIPS for America award will provide Samsung Austin, Texas up to $4.745 billion in total direct funding under the CHIPS and Science Act to support the expansion of a facility that has been an economic engine for Central Texas for nearly 30 years. This investment would expand the existing facilities to support the production of leading fully depleted silicon-on-insulator (FD-SOI) process technologies for critical U.S. industries, including aerospace, defense, and automotive. This investment also includes commitments to collaborate with the U.S. Department of Defense.

The CHIPS for America award will provide Samsung Austin, Texas up to $4.745 billion in total direct funding under the CHIPS and Science Act to support the construction of a comprehensive advanced manufacturing ecosystem that includes both high volume leading-edge logic manufacturing and dedicated space for R&D and will transform the small municipality of Taylor into an expansive hub of leading-edge semiconductor manufacturing. This ecosystem would include two leading-edge logic foundry fabs focused on mass production of 2nm process technologies and an R&D lab dedicated to research and development of manufacturing process nodes at least several generations ahead of the current one in production.

The CHIPS for America investment in SK Hynix of up to $458 million in direct funding under the CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging fabrication and research and development (R&D) facility.

The CHIPS for America award will provide GlobaWafers with $20 million in direct funding under the CHIPS and Science Act to support the construction of a 300mm silicon-on-insulator (SOI) wafer-manufacturing facility, critical for advanced semiconductor applications.

The CHIPS for America award will provide GlobaWafers with $380 million in direct funding under the CHIPS and Science Act to support the construction of a 300mm silicon wafer manufacturing facility for all chips, including leading-edge, mature-node, and memory chips.

This proposed CHIPS for America investment would support Bosch’s planned investment to transform its manufacturing facility in Roseville, California, for production of silicon carbide (SiC) power semiconductors.

The CHIPS for America award will provide Micron New York direct funding under the CHIPS and Science Act to support construction of the first two fabs of planned four fab “megafab” focused on leading-edge DRAM chip production. Each fab will have 600,000 square feet of cleanrooms, totaling 2.4 million square feet of cleanroom space across the four facilities—the largest amount of cleanroom space ever announced in the United States and the size of nearly 40 football fields.

The CHIPS for America award will provide Micron Boise Idaho direct funding under the CHIPS and Science Act to support the development of two high-volume manufacturing (HVM) fabs, with approximately 600,000 square feet of cleanroom space focused on the production of leading-edge DRAM chips. The fabs would be co-located with the company’s R&D facility to improve efficiency across their R&D and manufacturing operations, reducing lags in technology transfer and cutting time-to-market for leading-edge memory products.

The proposed investment in X-Fab would support the modernization and expansion of its existing silicon carbide fab in Lubbock, Texas.

The proposed investment in SkyWater Technology Foundry would support the modernization of its existing facility in Bloomington, Minnesota.