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Displaying 1 - 25 of 78

Experimental study of shear and tensile properties of LIGA Ni-Fe and Ni-Co alloys at quasi-static and intermediate strain rates

April 1, 2021
Author(s)
Li-Anne Liew, David T. Read, May Martin, Todd R. Christenson, Peter E. Bradley, Nicholas Barbosa, Frank W. DelRio, John T. Geaney, Jeffrey Smyth
We report the in-plane shear properties, to fracture, of 200 um-thick LIGA nanocrystalline Ni- 10%Fe and micrograined Ni-10%Co. Planar simple shear specimens were designed, fabricated and pulled to fracture using a miniature commercial tension test stage

Elastic-plastic properties of mesoscale electrodeposited LIGA nickel alloy films: microscopy and mechanics

November 22, 2020
Author(s)
Li-Anne Liew, David T. Read, May Martin, Frank W. DelRio, Peter E. Bradley, Nicholas Barbosa, Todd R. Christenson, John T. Geaney
The elastic-plastic properties of mesoscale electrodeposited LIGA Ni alloy specimens are investigated as a function of specimen size, strain rate, and material composition. Two material compositions are studied: a high-strength fine-grained Ni-Fe alloy and

Dominant factors for fracture at the micro-scale in electrodeposited nickel alloys

August 1, 2020
Author(s)
May L. Martin, Li-Anne Liew, David T. Read, Todd Christensen, Frank W. DelRio, John Geaney
Two different LIGA electrodeposited nickel alloys displayed distinct fracture modes after meso- scale tensile testing. The Ni-Co alloy failed in a ductile manner, while the Ni-Fe alloy failed in a more brittle-appearing manner. Various factors affecting

A ROUND ROBIN EXPERIMENT TO SUPPORT BOND VOID MEASUREMENT STANDARDS

May 1, 2016
Author(s)
Richard A. Allen, David T. Read, Victor H. Vartanian, Winthrop A. Baylies, William Kerr, Mark Plemmons, Kevin T. Turner
A round robin experiment to compare the sensitivities of various metrology tools to small voids between bonded wafers such as are used in three-dimensional stacked integrated circuits (3DS-ICs) and MEMS packaging. Participants received a set of four bonded

Metrology for 3D Integration

May 13, 2014
Author(s)
Richard A. Allen, Victor H. Vartanian, David T. Read, Winthrop A. Baylies
Three-dimensional stacked integrated circuit (3DS-IC) fabrication requires complex technologies such as high-aspect ratio through- silicon vias (TSVs), wafer thinning, thin wafer handling and processing, and bonding of thin wafers with complex patterned

MEMS Device for Fatigue Testing of 25 mm Thick Aluminum Specimens

June 13, 2013
Author(s)
Li-Anne Liew, David T. Read, Nicholas Barbosa
We report the development and demonstration of a MEMS test instrument to perform fatigue testing on 25 µm thick aluminum 1145 H19 foil. Both the foil material and the specimen fabrication were obtained from commercial sources, separate from the fabrication

User's Guide for RM 8096 and 8097: The MEMS 5-in-1, 2013 Edition

February 15, 2013
Author(s)
Janet M. Cassard, Jon C. Geist, Theodore V. Vorburger, David T. Read, Michael Gaitan, David G. Seiler
The Microelectromechanical Systems (MEMS) 5-in-1 is a reference device sold as a NIST Reference Material (RM) that contains MEMS test structures on a test chip. The two RM chips (8096 and 8097) provide for both dimensional and material property

EVALUATING METHODS OF SHIPPING THIN SILICON WAFERS FOR 3D STACKED APPLICATIONS

November 7, 2012
Author(s)
Richard A. Allen, Urmi Ray, Vidhya Ramachandran, Iqbal Ali, David T. Read, Andreas Fehk?hrer, J?rgen Burggraf
An experiment was performed to develop a method for choosing appropriate packaging for shipping 300 mm silicon wafers thinned to 100 µm or less for three-dimensional stacked integrated circuits (3DS-ICs). 3DS-ICs hold the promise of improved performance

MEMS-based universal fatigue test technique

August 22, 2012
Author(s)
Li-Anne Liew, David T. Read, Nicholas Barbosa
We have developed a MEMS (micro electro mechanical systems) -based method for fatigue testing of micro- to millimeter-sized specimens of any material (hence ‘universal’). The miniature, re- usable, stand-alone fatigue test frame is fabricated as a single

Reliability Testing of Advanced Interconnect Materials

November 10, 2011
Author(s)
Robert R. Keller, Mark C. Strus, Ann C. Chiaramonti Debay, David T. Read, Younglae Kim, Yung J. Jung
We describe the development of electrical test methods to evaluate damage that determines reliability in advanced, small-scale conductors, including damascene copper and aligned carbon nanotube networks. Rapid thermal cycling induced during high-current AC

User's Guide for SRM 2494 and 2495: The MEMS 5-in-1, 2011 Edition

September 6, 2011
Author(s)
Janet M. Cassard, Jon C. Geist, Theodore V. Vorburger, David T. Read, David G. Seiler
The Microelectromechanical Systems (MEMS) 5-in-1 is a standard reference device sold as a NIST Standard Reference Material (SRM) that contains MEMS test structures on a test chip. The two SRM chips (2494 and 2495) provide for both dimensional and material

Modeling electromigration using the peridynamics approach

August 28, 2011
Author(s)
David T. Read, Walter Gerstle, Vinod K. Tewary
This chapter presents a summary of the information and reasoning needed to justify learning about peridynamics for the purpose of analyzing electromigration and provides guidance for the development of a complete peridynamics analysis. The additions needed

Electromigration of Cu Interconnects Under AC and DC Test Conditions

May 15, 2011
Author(s)
Robert R. Keller, David T. Read, Roey Shaviv, Greg Harm, Sangita Kumari
Electromigration of a 65 nm technology generation test vehicle was measured using DC, AC followed by DC, and three rectangular wave DC stressing conditions at 598 K. In some of the experiments samples were allowed to cool to room temperature between stress