Published: August 26, 2014
Ann C. Chiaramonti Debay, Sten Vollebregt, Aric W. Sanders, Alexandra E. Curtin, R. Ishihara, David T. Read
In this extended abstract we present our recent results on the reliability testing of multi-wall carbon nanotube vertical interconnects (vias).
Citation: Microscopy and Microanalysis
Pub Type: Journals
carbon nanotube, electrical testing, IV curves, reliability, via
Created August 26, 2014, Updated February 19, 2017