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Reliability of Low Temperature Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits

Published

Author(s)

Ann C. Chiaramonti Debay, Sten Vollebregt, Aric W. Sanders, Alexandra E. Curtin, R. Ishihara, David T. Read

Abstract

In this extended abstract we present our recent results on the reliability testing of multi-wall carbon nanotube vertical interconnects (vias).
Citation
Microscopy and Microanalysis

Keywords

carbon nanotube, electrical testing, IV curves, reliability, via

Citation

Chiaramonti, A. , Vollebregt, S. , Sanders, A. , Curtin, A. , Ishihara, R. and Read, D. (2014), Reliability of Low Temperature Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits, Microscopy and Microanalysis (Accessed May 25, 2022)
Created August 26, 2014, Updated February 19, 2017