Reliability of Low Temperature Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits

Published: August 26, 2014

Author(s)

Ann C. Chiaramonti Debay, Sten Vollebregt, Aric W. Sanders, Alexandra E. Curtin, R. Ishihara, David T. Read

Abstract

In this extended abstract we present our recent results on the reliability testing of multi-wall carbon nanotube vertical interconnects (vias).
Citation: Microscopy and Microanalysis
Pub Type: Journals

Keywords

carbon nanotube, electrical testing, IV curves, reliability, via
Created August 26, 2014, Updated February 19, 2017