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PUBLICATIONS

Reliability of Low Temperature Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits

Published

Author(s)

Ann C. Chiaramonti Debay, Sten Vollebregt, Aric W. Sanders, Alexandra E. Curtin, R. Ishihara, David T. Read

Abstract

In this extended abstract we present our recent results on the reliability testing of multi-wall carbon nanotube vertical interconnects (vias).
Citation
Microscopy and Microanalysis
Pub Type
Journals

Keywords

carbon nanotube, electrical testing, IV curves, reliability, via
Materials, Polymers, Nanotechnology, Nanoelectronics, Nanomaterials and Nanometrology

Citation

Chiaramonti, A. , Vollebregt, S. , Sanders, A. , Curtin, A. , Ishihara, R. and Read, D. (2014), Reliability of Low Temperature Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits, Microscopy and Microanalysis (Accessed December 12, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created August 26, 2014, Updated February 19, 2017