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PUBLICATIONS

Modeling electromigration using the peridynamics approach

Published

Author(s)

David T. Read, Walter Gerstle, Vinod K. Tewary

Abstract

This chapter presents a summary of the information and reasoning needed to justify learning about peridynamics for the purpose of analyzing electromigration and provides guidance for the development of a complete peridynamics analysis. The additions needed to convert the original peridynamics model as developed for mechanics problems to a multiphysics model capable of treating electromigration are reviewed. Experimental data on void drift by electromigration are introduced to provide a specific target for a demonstration of the peridynamical approach. Model results for the basic phenomena of this experiment are presented. The peridynamics approach appears capable of simultaneously accommodating both constitutive laws and explicit treatment of multi-body interactions, for handling different aspects of the behavior of the material system to be modeled.
Citation
Electromigration in Thin Films and Electronic Devices: Materials and Reliability
Publisher Info
Woodhead Publishing Limited, Cambridge, -1
Pub Type
Book Chapters

Keywords

Electromigration, interconnect, interface, modeling, peridynamics, theory, voids.
Materials, Metals and Modeling and simulation research

Citation

Read, D. , Gerstle, W. and Tewary, V. (2011), Modeling electromigration using the peridynamics approach, Electromigration in Thin Films and Electronic Devices: Materials and Reliability, Woodhead Publishing Limited, Cambridge, -1 (Accessed October 9, 2025)

Issues

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Created August 28, 2011, Updated February 19, 2017
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