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Search Publications by: Yaw S. Obeng (Fed)

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Displaying 1 - 25 of 172

INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMSTM 2023 EDITION METROLOGY

December 8, 2023
Author(s)
Elisabeth Mansfield, Bryan Barnes, R Joseph Kline, Andras E. Vladar, Yaw S. Obeng, Albert Davydov
The Metrology Chapter identifies emerging measurement challenges from devices, systems, and integration of new materials in the semiconductor industry and describes research and development pathways for meeting them. This includes but not limited to

Towards the Physical Reliability of 3D-Integrated Systems: Broadband Dielectric Spectroscopic (BDS) Studies of Material Evolution and Reliability in Integrated Systems

September 30, 2022
Author(s)
Papa Amoah, Joseph J. Kopanski, Yaw S. Obeng, Christopher Sunday, Chukwudi Okoro, Lin You, Dmirty Veksler
In this paper, we present an overview of our current research focus in developing non-destructive metrology for monitoring reliability issues in 3D-integrated electronic systems. We introduce a suite of non-destructive metrologies that can serve as early

Broadband Dielectric Spectroscopic Detection of Ethanol: A Side-by-Side Comparison of ZnO and HKUST-1 MOFs as Sensing Media

June 25, 2022
Author(s)
Papa Amoah, Pentao Lin, Zeinab Mohammed Hassan, Rhonda Franklin, Engelbert Redel, Helmut Baumgart, Yaw S. Obeng
Changes in the chemo-electrical intrinsic properties of metal-oxide materials (MO) are commonly used as the basis of gas sensors. The most common gas sensors are based on chemically induced changes in electrical resistivity which necessarily involve making

Models for an Ultraviolet-C Research and Development Consortium

March 25, 2022
Author(s)
Dianne L. Poster, C Cameron Miller, Yaw S. Obeng, John J. Kasianowicz, Michael T. Postek, Norman Horn, Troy Cowan, Richard Martinello
The development of an international, precompetitive, collaborative, ultraviolet (UV) research consortium is discussed as an opportunity to lay the groundwork for a new UV commercial industry and the supply chain to support this industry. History has

Deterministic Tagging Technology for Device Authentication

September 16, 2021
Author(s)
Jungjoon Ahn, Joseph J. Kopanski, Yaw S. Obeng, Jihong Kim
This paper discusses the development of a rapid, large-scale integration of deterministic dopant placement technique for encoding information in physical structures at the nanoscale. The doped structures inherit identical and customizable radiofrequency