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PUBLICATIONS

Towards the Physical Reliability of 3D-Integrated Systems: Broadband Dielectric Spectroscopic (BDS) Studies of Material Evolution and Reliability in Integrated Systems

Published

Author(s)

Papa Amoah, Joseph J. Kopanski, Yaw S. Obeng, Christopher Sunday, Chukwudi Okoro, Lin You, Dmirty Veksler

Abstract

In this paper, we present an overview of our current research focus in developing non-destructive metrology for monitoring reliability issues in 3D-integrated electronic systems. We introduce a suite of non-destructive metrologies that can serve as early warning monitors for reliability issues. These Broadband Dielectric Spectroscopic (BDS) techniques are based on the application of high frequency microwaves (up to 40 GHz) to devices under various external stress, to probe impedance changes due to material and structural changes in integrated circuits. We illustrate the capabilities of the techniques with four case studies of potential reliability issues in 3D-IC interconnects.
Proceedings Title
ECS Transactions, volume 109 (issue 2)
Volume
109
Issue
2
Conference Dates
October 9-13, 2022
Conference Location
Atlanta, GA, US
Conference Title
242nd ECS Meeting
Pub Type
Conferences

Download Paper

https://doi.org/10.1149/10902.0041ecst
Local Download

Keywords

Broadband Dielectric Spectroscopy, Reliability, accelerated aging, 3D-integrated circuits, non-destructive metrology
Semiconductors, Manufacturing quality assurance, Process improvement, Materials characterization, Materials, Manufacturing, Electronics, Electrical / electromagnetic metrology and Chemistry

Citation

Amoah, P. , Kopanski, J. , Obeng, Y. , Sunday, C. , Okoro, C. , You, L. and Veksler, D. (2022), Towards the Physical Reliability of 3D-Integrated Systems: Broadband Dielectric Spectroscopic (BDS) Studies of Material Evolution and Reliability in Integrated Systems, ECS Transactions, volume 109 (issue 2), Atlanta, GA, US, [online], https://doi.org/10.1149/10902.0041ecst, https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=935248 (Accessed October 4, 2024)

Issues

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Created September 30, 2022, Updated November 29, 2022