Skip to main content
U.S. flag

An official website of the United States government

Dot gov

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Https

Secure .gov websites use HTTPS
A lock ( ) or https:// means you've safely connected to the .gov website. Share sensitive information only on official, secure websites.

Application of Broadband RF Metrology to Integrated Circuit Interconnect Reliability Analyses: Monitoring Copper Interconnect Corrosion in 3D-ICs

Published

Author(s)

Papa K. Amoah, Jesus Perez, Yaw S. Obeng

Abstract

In this paper, we describe the development, and application, of a suite of high-frequency electromagnetic wave (RF) based techniques to probe material and structural changes in copper interconnects in TSV enabled 3-D integrated circuits during high-temperature storage. Illustratively, we discuss how RF insertion loss (S21) based-techniques have been used to study the oxidation of copper interconnects in 3D-ICs. We compare the microwave insertion loss results to those from DC measurements and discuss the advantages of the former technique over the latter. Using electrodynamic simulations, we discuss the partitioning of microwave signal loss in corroded copper interconnects, and the significance of the roughness at the air-copper oxide interface.
Proceedings Title
2020 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, April 6-9, EDINBURGH, UNITED
KINGDOM
Conference Dates
April 6-9, 2020
Conference Location
Edinburgh, -1

Keywords

metrology, microwave, corrosion, interconnect
Created June 3, 2020, Updated September 4, 2020