Evaluating solder joint failures and solder joint reliability: A side-by-side comparison of Direct Current and Microwave Based Monitoring Techniques
Yaw S. Obeng, Papa Amoah
Historically, the evaluating solder joint failures and solder joint reliability have been done with DC methods using event detectors or data loggers for high-frequency circuits. Direct high-frequency RF measurements of signal paths are potentially more sensitive to incipient circuit (or solder joint) failure due to mechanical changes which may affect return loss, insertion loss, or phase angle, well before complete solder joint failure. In this paper, we compare the fault detection capabilities and detection speeds, of direct current resistance (RDC) to RF-based fault detection measurements to determine if RF signal loss could be a useful criterion for failure detection. Early S-parameter changes were observed, over time and thermal cycles, as the connectors were broken in from wear. Ultimately, the test circuits failed, due to cracks within the solder joints. The capacitance, and the capacitive reactance, of a partial crack in a solder joint was found to be substantially much larger than the resistance due to even tiny remaining
Proceedings of the 2021 IPC Apex Expo Technical Conference
and Amoah, P.
Evaluating solder joint failures and solder joint reliability: A side-by-side comparison of Direct Current and Microwave Based Monitoring Techniques, Proceedings of the 2021 IPC Apex Expo Technical Conference, San Diego, CA, US, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=931483
(Accessed July 6, 2022)