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Search Publications by: Eric K. Lin (Fed)

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Displaying 76 - 100 of 392

Critical Role of Side-Chain Attachment Density on the Order and Device Performance of Polythiophenes

October 30, 2007
Author(s)
Regis J. Kline, Dean DeLongchamp, Daniel A. Fischer, Eric K. Lin, Lee J. Richter, Michael L. Chabinyc, Martin Heeney, Iain McCulloch
High performance, solution processable semiconductors are critical to the realization of low cost, large area electronics. We show that a signature molecular packing motif - side-chain interdigitation - correlates to high performance for a large and

Mesoporous Silica Films with Long-Range Order Prepared from Strongly Segregated Block Copolymer/Homopolymer Blend Templates

October 24, 2007
Author(s)
Vijay Tirumala, R A. Pai, Sumit Agarwal, Curran Chandler, Gaurav Bhatnagar, Alvin Omang, Eric K. Lin, J J. Watkins
Well ordered mesoporous silica films were prepared by infusion and selective condensation of Si alkoxides within pre-organized block copolymer/homopolymer blend templates using supercritical CO2 as the delivery medium. The morphologies of mesoporous silica

The Molecular Origin of Enhanced Toughness in Double-Network Hydrogels

October 22, 2007
Author(s)
Taiki Tominaga, Vijay Tirumala, Eric K. Lin, Jian P. Gong, Hidemitsu Furukawa, Yoshihito Osada, Wen-Li Wu
The long-standing pursuit of a synthetic equivalent to tissue cartilage has seen significant new activity with the development of a new materials strategy: double-network hydrogels (DN-gels) prepared from a combination of an anionic polyelectrolyte and a

The Direct Patterning of Nanoporous Interlayer Dielectric Insulator Films by Nanoimprint Lithography

October 2, 2007
Author(s)
Hyun Wook Ro, Ronald L. Jones, H Peng, Daniel R. Hines, Hae-Jeong Lee, Eric K. Lin, Alamgir Karim, Do Y. Yoon, D Gidley, Christopher L. Soles
Directly patterning dielectric insulator materials via nanoimprint lithography has the potential to simplify fabrication processes and significantly reduce the manufacturing costs for semiconductor devices. However, the prospect of mechanically forming

I-NEMI 2007 Organic and Printed Electronics Roadmap

April 2, 2007
Author(s)
Jan Obrzut, Regis J. Kline, Eric K. Lin, David J. Gundlach, Daniel Gamota
This roadmap provides an overview of the most critical technologies necessary for commercial launch and market diffusion of organic & printed electronics based products. To the best of our knowledge, this roadmap is the first of its kind and as such should

High Carrier Mobility Polythiophene Thin Films: Structure Determination by Experiment and Theory

March 19, 2007
Author(s)
Dean M. DeLongchamp, Regis J. Kline, Eric K. Lin, Daniel A. Fischer, Lee J. Richter, Leah A. Lucas, Martin Heeney, Iain McCulloch, John E. Northrup
We exploit the unprecedented crystallinity of poly(2,5-bis(3-alkylthiophene-2-yl)thieno[3,2-b]thiophenes) (pBTTTs) high performance semiconducting polymers to study structural detail within 25 nm thick films of a pBTTT with tetradecyl side chains (pBTTT