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Search Publications by: Thomas P. Moffat (Fed)

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Displaying 76 - 100 of 165

Superconformal Ni Electrodeposition using 2-Mercaptobenzimidazole

April 4, 2011
Author(s)
Chang H. Lee, John E. Bonevich, Ugo Bertocci, Kristen L. Steffens, Thomas P. Moffat
Ni superconformal filling of sub-micrometer trenches is demonstrated using a Watts bath containing an inhibitor 2-mercaptobenzimidazole (MBI). Hysteretic voltammetry marks the breakdown of the MBI-induced passive-state coincident with the onset of Ni

Superconformal Electrodeposition for 3-D Interconnects

September 7, 2010
Author(s)
Thomas P. Moffat, Daniel Josell
Electrodeposition is a key fabrication process used in the state-of-the-art multilevel Cu metallization of microelectronic interconnects from transistor to circuit board length scale. Recent electrochemical surface science and feature filling studies have

Accelerator Surface Phase Associated with Superconformal Cu Electrodeposition

March 5, 2010
Author(s)
Thomas P. Moffat, Liang Yueh Ou Yang
Superconformal film growth is a key process in state-of-the-art Cu metallization of electronic devices. Superfilling of recessed surface features results from competition between electrolyte additives that accelerate or inhibit Cu electroplating. In situ

3-D Metallization by Damascene Electrodeposition

January 1, 2010
Author(s)
Thomas P. Moffat, Chang H. Lee, Daniel Josell
Electrodeposition is a key fabrication process used in the state-of-the-art multilevel Cu metallization of microelectronic interconnects from transistor to circuit board length scale. Recent electrochemical surface science and feature filling studies have

Electrochemical Micromachining of Hastelloy B-2 with Ultrashort Voltage Pulses

September 8, 2009
Author(s)
Gordon A. Shaw, Joseph J. Maurer, Steven E. Fick, Thomas P. Moffat, J. J. Mallett, John L. Hudson
Electrochemical micromachining (ECMM) with ultrashort voltage pulses, a maskless all-electrochemical micro and nanofabrication technique, has been used to fabricate microstructures on a corrosion resistant nickel-based superalloy, Hastelloy B-2. Because of

Three-Dimensionally Structured CdTe Thin Film Photovoltaic Devices with Self-Aligned Back Contacts: Electrodeposition on Interdigitated Electrodes.

June 25, 2009
Author(s)
Daniel Josell, Carlos R. Beauchamp, Suyong S. Jung, Behrang H. Hamadani, Abhishek Motayed, Lee J. Richter, Maureen E. Williams, John E. Bonevich, Alexander J. Shapiro, Nikolai B. Zhitenev, Thomas P. Moffat
Cadmium-telluride photovoltaic cells were deposited on substrates patterned with two interdigitated electrodes. Deposition involved application of different potentials to the two electrodes in order to obtain a 3-d gradient of film properties within the

Compositional Control in Electrodeposition of FePt Films.

October 16, 2008
Author(s)
J Mallett, Erik B. Svedberg, S Sayan, Alexander J. Shapiro, William F. Egelhoff Jr., Thomas P. Moffat
A series of smooth Fe-Pt thin film alloys have been grown by electrodeposition at potentials positive to that required to deposit elemental Fe. XRD of 100 nm thick FePt films indicate the formation of fine grained face centered cubic alloys, and the

Control of Overfill Bumps in Damascene Cu Electrodeposition

October 16, 2008
Author(s)
Soo K. Kim, Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Electroanalytical measurements and feature filling experiments have been conducted to study the effect of dodecyltrimethylammonium chloride (DTAC) and branched polyethyleneimine (PEI) on Cu deposition as levelers in the presence of various combinations of

Dissolution Dynamics of Artificially Structured Materials

October 16, 2008
Author(s)
M Shima, L Salamanca-Riba, Thomas P. Moffat
The anodic dissolution of an ultrathin cobalt film buried beneath a copper overlayer has been studied using voltammetry and chronoamperometry. The films were produced by sequential electrodeposition of cobalt and copper layers from a solution of 1.5 mol/L

Electrodeposited Epitaxial Fe Subscript 100-x}Co Subscript x} Films on GaAs

October 16, 2008
Author(s)
J Mallett, Erik B. Svedberg, Mark D. Vaudin, Leonid A. Bendersky, William F. Egelhoff Jr., Thomas P. Moffat
The electrodeposition of epitaxial cube-on-cube Fe _(subscript) 100-x}Co_(subscript) x} films onto n-GaAs is described from ferrous ammonium sulfate solutions containing various concentrations of cobalt sulfate. The cobalt composition in a series of 400nm

STM Studies of Halide Adsorption on CU(100), CU(110) and CU(111)

October 16, 2008
Author(s)
Thomas P. Moffat
The potential dependent adsorption of chloride and bromide on the three low index copper surfaces has been examined with voltammetry and STM. At saturation coverage, ordered halide adlayers are observed on all three surfaces; (square root 2 x square root 2